Toshiharu Yubitani

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Miyazaki-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor wafers
- Patent number 6,162,730
- Issue date Dec 19, 2000
- Komatsu Electronic Metals Co., Ltd.
- Fumitaka Kai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for fabricating semiconductor wafers
- Patent number 5,899,743
- Issue date May 4, 1999
- Komatsu Electronic Metals Co., Ltd.
- Fumitaka Kai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Process for fabricating semiconductor wafer
- Patent number 5,880,027
- Issue date Mar 9, 1999
- Komatsu Electronic Metals Co., Ltd.
- Hirofumi Hajime
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing the top and bottom of a semiconductor wafer si...
- Patent number 5,873,772
- Issue date Feb 23, 1999
- Komatsu Electronic Metals Co., Ltd.
- Hirofumi Hajime
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor wafers
- Patent number 5,821,166
- Issue date Oct 13, 1998
- Komatsu Electronic Metals Co., Ltd.
- Hirofumi Hajime
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making semiconductor wafer
- Patent number 5,756,399
- Issue date May 26, 1998
- Komatsu Electronic Metals Co. Ltd.
- Hirofumi Hajime
- B28 - WORKING CEMENT, CLAY, OR STONE