Toshihiko Isokawa

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Ina-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with through-hole
- Patent number 7,180,149
- Issue date Feb 20, 2007
- Fujikura Ltd.
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor substrate provided with a t...
- Patent number 7,022,609
- Issue date Apr 4, 2006
- Fujikura Ltd.
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actuator
- Patent number 6,949,996
- Issue date Sep 27, 2005
- Olympus Corporation
- Kazuya Matsumoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package and method of manufacturing same
- Publication number 20050056903
- Publication date Mar 17, 2005
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a semiconductor substrate provided with a t...
- Publication number 20040043615
- Publication date Mar 4, 2004
- FUJIKURA LTD.
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actuator
- Publication number 20020149294
- Publication date Oct 17, 2002
- Olympus Optical Co., Ltd.
- Kazuya Matsumoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY