Toshihiko Kitamura

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board, electronic component package, and electronic apparatus
- Patent number 12,068,420
- Issue date Aug 20, 2024
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic component package, and electronic apparatus
- Patent number 11,889,618
- Issue date Jan 30, 2024
- Kyocera Corporation
- Toshihiko Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, optical semiconductor element package, and optical se...
- Patent number 10,512,155
- Issue date Dec 17, 2019
- KYOCERA Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element housing package, semiconductor device, and mo...
- Patent number 9,443,777
- Issue date Sep 13, 2016
- KYOCERA Corporation
- Mahiro Tsujino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS
- Publication number 20240405130
- Publication date Dec 5, 2024
- Kyocera Corporation
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE
- Publication number 20240243055
- Publication date Jul 18, 2024
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20230057427
- Publication date Feb 23, 2023
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS
- Publication number 20220217834
- Publication date Jul 7, 2022
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS
- Publication number 20220165889
- Publication date May 26, 2022
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, OPTICAL SEMICONDUCTOR ELEMENT PACKAGE, AND OPTICAL SE...
- Publication number 20180352648
- Publication date Dec 6, 2018
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT HOUSING PACKAGE, SEMICONDUCTOR DEVICE, AND MO...
- Publication number 20150130043
- Publication date May 14, 2015
- KYOCERA CORPORATION
- Mahiro Tsujino
- H01 - BASIC ELECTRIC ELEMENTS

Toshihiko Kitamura

Person

Patents Grantslast 30 patents

Wiring board, electronic component package, and electronic apparatus

Wiring board, electronic component package, and electronic apparatus

Wiring board, optical semiconductor element package, and optical se...

Semiconductor element housing package, semiconductor device, and mo...

Patents Applicationslast 30 patents

WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS

ELECTRONIC-COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE

WIRING BASE AND ELECTRONIC DEVICE

WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS

WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS

WIRING BOARD, OPTICAL SEMICONDUCTOR ELEMENT PACKAGE, AND OPTICAL SE...

SEMICONDUCTOR ELEMENT HOUSING PACKAGE, SEMICONDUCTOR DEVICE, AND MO...