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Toshihiko Taguchi

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  • Saitama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead-free solder
    • Patent number 8,220,692
    • Issue date Jul 17, 2012
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste and printed circuit board
    • Patent number 7,681,777
    • Issue date Mar 23, 2010
    • Senju Metal Industry Co., Ltd.
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder and soldered article
    • Patent number 7,282,174
    • Issue date Oct 16, 2007
    • Senju Metal Industry Co., Ltd.
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 6,926,849
    • Issue date Aug 9, 2005
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder paste for reflow soldering
    • Patent number 6,896,172
    • Issue date May 24, 2005
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 6,736,907
    • Issue date May 18, 2004
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloys
    • Patent number 6,503,338
    • Issue date Jan 7, 2003
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloys
    • Patent number 6,488,888
    • Issue date Dec 3, 2002
    • Matsushita Electric Industrial Co., Ltd.
    • Toshikazu Murata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free zinc-containing solder paste
    • Patent number 6,440,228
    • Issue date Aug 27, 2002
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thermosetting soldering flux and soldering process
    • Patent number 6,402,013
    • Issue date Jun 11, 2002
    • Senju Metal Industry Co., Ltd.
    • Hisayuki Abe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloys
    • Patent number 6,241,942
    • Issue date Jun 5, 2001
    • Matsushita Electric Industrial Co., Ltd.
    • Toshikazu Murata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste
    • Patent number 6,159,304
    • Issue date Dec 12, 2000
    • Matsushita Electric Industrial Co., Ltd.
    • Hiroji Noguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste for chip components
    • Patent number 6,050,480
    • Issue date Apr 18, 2000
    • Senju Metal Industry, Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Paste solder with minimized residue
    • Patent number 5,176,759
    • Issue date Jan 5, 1993
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Water-soluble soldering flux
    • Patent number 5,074,928
    • Issue date Dec 24, 1991
    • Nippondenso Co., Ltd.
    • Masaki Sanji
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Water-soluble soldering flux and paste solder using the flux
    • Patent number 4,988,395
    • Issue date Jan 29, 1991
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SOLDERING ALLOY AND SOLDER JOINT
    • Publication number 20200384577
    • Publication date Dec 10, 2020
    • SENJU METAL INDUSTRY CO., LTD
    • Takeshi SAKAMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER
    • Publication number 20110089224
    • Publication date Apr 21, 2011
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder paste and printed board
    • Publication number 20060261131
    • Publication date Nov 23, 2006
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder and soldered article
    • Publication number 20060102690
    • Publication date May 18, 2006
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder paste for reflow soldering
    • Publication number 20040217152
    • Publication date Nov 4, 2004
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder pastes
    • Publication number 20040069974
    • Publication date Apr 15, 2004
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder paste
    • Publication number 20030121564
    • Publication date Jul 3, 2003
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloys
    • Publication number 20030021719
    • Publication date Jan 30, 2003
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free Zinc-Containing Solder Paste
    • Publication number 20020050305
    • Publication date May 2, 2002
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloys
    • Publication number 20020015660
    • Publication date Feb 7, 2002
    • Toshikazu Murata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Thermosetting soldering flux and soldering process
    • Publication number 20010019075
    • Publication date Sep 6, 2001
    • Hisayuki Abe
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR