Toshihiko Watase

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Abrasive pad for CMP

    • Patent number 6,776,699
    • Issue date Aug 17, 2004
    • 3M Innovative Properties Company
    • Takashi Amano
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

  • Information Patent Application

    ABRASIVE MATERIAL HAVING A STRUCTURED SURFACE

    • Publication number 20170008143
    • Publication date Jan 12, 2017
    • 3M INNOVATIVE PROPERTIES COMPANY
    • Hideki Minami
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Abrasive pad for cmp

    • Publication number 20040003895
    • Publication date Jan 8, 2004
    • Takashi Amano
    • B24 - GRINDING POLISHING