Toshihiro FURUSAWA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Chip size package (CSP)
- Patent number 9,287,307
- Issue date Mar 15, 2016
- Sony Corporation
- Yukihisa Kinugasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and camera apparatus and parallel link mechanism for...
- Patent number 9,253,387
- Issue date Feb 2, 2016
- Sony Corporation
- Toshihiro Furusawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module, and manufacturing device and method for the same
- Patent number 8,860,878
- Issue date Oct 14, 2014
- Sony Corporation
- Toshiaki Iwafuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency-signal receiver and method of manufacturing the same
- Patent number 7,630,686
- Issue date Dec 8, 2009
- Panasonic Corporation
- Junichi Fukutani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High-frequency receiver having a gain switch controller
- Patent number 7,580,690
- Issue date Aug 25, 2009
- Panasonic Corporation
- Akira Fujishima
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High-frequency signal receiving apparatus
- Patent number 7,194,245
- Issue date Mar 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshihiro Furusawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image signal recording and reproducing apparatus
- Patent number 6,134,375
- Issue date Oct 17, 2000
- Sanyo Electric Co., Ltd.
- Kazuo Naganawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Imaging system with image processing for re-writing a portion of a...
- Patent number 5,920,343
- Issue date Jul 6, 1999
- Sanyo Electric Company, Ltd.
- Tohru Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conserving stored charge in apparatus having a charge coupled device
- Patent number 4,597,092
- Issue date Jun 24, 1986
- Sanyo Electric Co., Ltd.
- Toshihiro Furusawa
- G11 - INFORMATION STORAGE
Information Patent Grant
CCD Imager
- Patent number 4,547,807
- Issue date Oct 15, 1985
- Sanyo Electric Co., Ltd.
- Nobuhiro Mitani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
CAMERA MODULE AND CAMERA APPARATUS
- Publication number 20150070565
- Publication date Mar 12, 2015
- SONY CORPOTATION
- Toshihiro Furusawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP SIZE PACKAGE (CSP)
- Publication number 20140246745
- Publication date Sep 4, 2014
- SONY CORPORATION
- Yukihisa KINUGASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE, AND MANUFACTURING DEVICE AND METHOD FOR THE SAME
- Publication number 20130033639
- Publication date Feb 7, 2013
- SONY CORPORATION
- Toshiaki IWAFUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-frequency receiver
- Publication number 20070049228
- Publication date Mar 1, 2007
- Akira Fujishima
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
High-frequency signal reception apparatus and manufacturing method...
- Publication number 20040153879
- Publication date Aug 5, 2004
- Junichi Fukutani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
High-frequency signal receiving apparatus
- Publication number 20040067744
- Publication date Apr 8, 2004
- Toshihiro Furusawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Toshihiro FURUSAWA

Person

Patents Grantslast 30 patents

Chip size package (CSP)

Camera module and camera apparatus and parallel link mechanism for...

Camera module, and manufacturing device and method for the same

Radio-frequency-signal receiver and method of manufacturing the same

High-frequency receiver having a gain switch controller

High-frequency signal receiving apparatus

Image signal recording and reproducing apparatus

Imaging system with image processing for re-writing a portion of a...

Conserving stored charge in apparatus having a charge coupled device

CCD Imager

Patents Applicationslast 30 patents

CAMERA MODULE AND CAMERA APPARATUS

CHIP SIZE PACKAGE (CSP)

CAMERA MODULE, AND MANUFACTURING DEVICE AND METHOD FOR THE SAME

High-frequency receiver

High-frequency signal reception apparatus and manufacturing method...

High-frequency signal receiving apparatus