Toshihiro Naoi

Follow

Person

Musashimurayama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus
- Patent number 6,244,493
- Issue date Jun 12, 2001
- Kabushiki Kaisha Shinkawa
- Eiichi Shimazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR