Toshihiro Yasuhara

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Patents Grantslast 30 patents

Information Patent Grant
Method of uniformly encapsulating a semiconductor device in resin
- Patent number 5,371,044
- Issue date Dec 6, 1994
- Hitachi, Ltd.
- Isamu Yoshida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and an electronic device with the semiconducto...
- Patent number 5,266,834
- Issue date Nov 30, 1993
- Hitachi Ltd.
- Kunihiko Nishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device having a particular mountin...
- Patent number 5,150,193
- Issue date Sep 22, 1992
- Hitachi, Ltd.
- Toshihiro Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 4,989,068
- Issue date Jan 29, 1991
- Hitachi, Ltd.
- Toshihiro Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 4,987,474
- Issue date Jan 22, 1991
- Hitachi, Ltd.
- Toshihiro Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS