Toshikazu Endo

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor embedded module and method for producing the same
- Patent number 8,742,589
- Issue date Jun 3, 2014
- TDK Corporation
- Kenichi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC-embedded module with multilayer substrates with mu...
- Patent number 7,812,444
- Issue date Oct 12, 2010
- TDK Corporation
- Masashi Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hard disk drive and wireless data terminal using the same
- Patent number 7,733,600
- Issue date Jun 8, 2010
- TDK Corporation
- Toshikazu Endo
- G11 - INFORMATION STORAGE
Information Patent Grant
Module with embedded semiconductor IC and method of fabricating the...
- Patent number 7,547,975
- Issue date Jun 16, 2009
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductive device and method for producing the same
- Patent number 7,167,071
- Issue date Jan 23, 2007
- TDK Corporation
- Minoru Takaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductance element, laminated electronic component, laminated elect...
- Patent number 7,081,803
- Issue date Jul 25, 2006
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
COMPOSITE MAGNETIC MATERIAL AND MAGNETIC MOLDING MATERIAL, MAGNETIC...
- Patent number 7,060,350
- Issue date Jun 13, 2006
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREP...
- Patent number 6,908,960
- Issue date Jun 21, 2005
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing multilayer substrate and electronic part, and...
- Patent number 6,808,642
- Issue date Oct 26, 2004
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts and method producing the same
- Patent number 6,749,928
- Issue date Jun 15, 2004
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts
- Patent number 6,713,162
- Issue date Mar 30, 2004
- TDK Corporation
- Minoru Takaya
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor embedded module and method for producing the same
- Publication number 20100013103
- Publication date Jan 21, 2010
- TDK Corporation
- Kenichi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor-embedded substrate and manufacturing method thereof
- Publication number 20080079146
- Publication date Apr 3, 2008
- TDK Corporation
- Yasuyuki Hattori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition, cured resin, sheet-like cured resin, laminated b...
- Publication number 20080044660
- Publication date Feb 21, 2008
- TDK Corporation
- Minoru Takaya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Hard disk drive and wireless data terminal using the same
- Publication number 20070076320
- Publication date Apr 5, 2007
- TDK CORPORATION
- Toshikazu Endo
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor IC-embedded module
- Publication number 20070057366
- Publication date Mar 15, 2007
- Masashi Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer substrate and method for producing same
- Publication number 20060180342
- Publication date Aug 17, 2006
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite dielectric material, composite dielectric substrate, prep...
- Publication number 20050154110
- Publication date Jul 14, 2005
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inductive device and method for producing the same
- Publication number 20050151613
- Publication date Jul 14, 2005
- TDK Corporation
- Minoru Takaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite dielectric material, composite dielectric substrate, prep...
- Publication number 20050130446
- Publication date Jun 16, 2005
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite dielectric material, composite dielectric substrate, prep...
- Publication number 20050130447
- Publication date Jun 16, 2005
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module with embedded semiconductor IC and method of fabricating the...
- Publication number 20050029642
- Publication date Feb 10, 2005
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition, cured resin, sheet-like cured resin, laminated b...
- Publication number 20050003199
- Publication date Jan 6, 2005
- TDK Corporation
- Minoru Takaya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electronic component and process for manufacturing the same
- Publication number 20040265551
- Publication date Dec 30, 2004
- TDK Corporation
- Minoru Takaya
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic parts and method producing the same
- Publication number 20040202848
- Publication date Oct 14, 2004
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inductance element, laminated electronic component, laminated elect...
- Publication number 20040183645
- Publication date Sep 23, 2004
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module component, core substrate element assembly, multi-layer subs...
- Publication number 20030039101
- Publication date Feb 27, 2003
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate for electronic part and electronic part
- Publication number 20030030994
- Publication date Feb 13, 2003
- TDK Corporation
- Minoru Takaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing multilayer substrate and electronic part, and...
- Publication number 20030029830
- Publication date Feb 13, 2003
- TDK Corp.
- Minoru Takaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite dielectric material, composite dielectric substrate, prep...
- Publication number 20020132898
- Publication date Sep 19, 2002
- TDK Corporation
- Minoru Takaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic parts and method producing the same
- Publication number 20020122934
- Publication date Sep 5, 2002
- TDK Corporation
- Minoru Takaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite magnetic material and magnetic molding material, magnetic...
- Publication number 20020039667
- Publication date Apr 4, 2002
- TDK Corporation
- Minoru Takaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic parts
- Publication number 20020009577
- Publication date Jan 24, 2002
- TDK Corporation
- Minoru Takaya
- H03 - BASIC ELECTRONIC CIRCUITRY

Toshikazu Endo

Person

Patents Grantslast 30 patents

Semiconductor embedded module and method for producing the same

Semiconductor IC-embedded module with multilayer substrates with mu...

Hard disk drive and wireless data terminal using the same

Module with embedded semiconductor IC and method of fabricating the...

Inductive device and method for producing the same

Inductance element, laminated electronic component, laminated elect...

COMPOSITE MAGNETIC MATERIAL AND MAGNETIC MOLDING MATERIAL, MAGNETIC...

COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREP...

Method for producing multilayer substrate and electronic part, and...

Electronic parts and method producing the same

Electronic parts

Patents Applicationslast 30 patents

Semiconductor embedded module and method for producing the same

Semiconductor-embedded substrate and manufacturing method thereof

Resin composition, cured resin, sheet-like cured resin, laminated b...

Hard disk drive and wireless data terminal using the same

Semiconductor IC-embedded module

Multilayer substrate and method for producing same

Composite dielectric material, composite dielectric substrate, prep...

Inductive device and method for producing the same

Composite dielectric material, composite dielectric substrate, prep...

Composite dielectric material, composite dielectric substrate, prep...

Module with embedded semiconductor IC and method of fabricating the...

Resin composition, cured resin, sheet-like cured resin, laminated b...

Electronic component and process for manufacturing the same

Electronic parts and method producing the same

Inductance element, laminated electronic component, laminated elect...

Module component, core substrate element assembly, multi-layer subs...

Substrate for electronic part and electronic part

Method for producing multilayer substrate and electronic part, and...

Composite dielectric material, composite dielectric substrate, prep...

Electronic parts and method producing the same

Composite magnetic material and magnetic molding material, magnetic...

Electronic parts