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Toshikazu Izumo
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Nagasaki, JP
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last 30 patents
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Patent Grant
Dispersion plating method
Patent number
5,196,107
Issue date
Mar 23, 1993
Mitsubishi Denki Kabushiki Kaisha
Yasuyuki Nakaoka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR