Toshikazu Oda

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Uji-Shi, Kyoto-Fu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for forming through holes in substrate of printed circuit b...
- Patent number 6,458,514
- Issue date Oct 1, 2002
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR