Toshikazu Okubo

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate for bonding using solder having a low melting poin...
- Patent number 9,883,586
- Issue date Jan 30, 2018
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing wiring substrate
- Patent number 9,572,252
- Issue date Feb 14, 2017
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for analyzing electrolytic copper plating solution
- Patent number 8,440,555
- Issue date May 14, 2013
- Toppan Printing Co., Ltd.
- Toshikazu Okubo
- G01 - MEASURING TESTING
Information Patent Grant
Method for analyzing copper electroplating solution, apparatus for...
- Patent number 7,820,535
- Issue date Oct 26, 2010
- Toppan Printing Co., Ltd.
- Toshikazu Okubo
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
BIOSENSOR AND A MANUFACTURING METHOD THEREFOR
- Publication number 20180228396
- Publication date Aug 16, 2018
- Toppan Printing Co., Ltd.
- Toshikazu OKUBO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTROPLATING SOLUTION ANALYZER AND ELECTROPLATING SOLUTION ANALYS...
- Publication number 20180106757
- Publication date Apr 19, 2018
- Toppan Printing Co., Ltd.
- Masahiro KOSUGI
- G01 - MEASURING TESTING
Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION ANALYZER, AND ELECTROLYTIC COP...
- Publication number 20160377573
- Publication date Dec 29, 2016
- Toppan Printing Co., Ltd.
- Masahiro KOSUGI
- G01 - MEASURING TESTING
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150334828
- Publication date Nov 19, 2015
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20140332259
- Publication date Nov 13, 2014
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR ANALYZING ELECTROLYTIC COPPER PLATING SOLUTION
- Publication number 20110025294
- Publication date Feb 3, 2011
- Toppan Printing Co., Ltd.
- Toshikazu Okubo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for analyzing electrolytic copper plating solution, and anal...
- Publication number 20060183257
- Publication date Aug 17, 2006
- Toshikazu Okubo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Toshikazu Okubo

Person

Patents Grantslast 30 patents

Wiring substrate for bonding using solder having a low melting poin...

Wiring substrate and method of manufacturing wiring substrate

Method for analyzing electrolytic copper plating solution

Method for analyzing copper electroplating solution, apparatus for...

Patents Applicationslast 30 patents

BIOSENSOR AND A MANUFACTURING METHOD THEREFOR

ELECTROPLATING SOLUTION ANALYZER AND ELECTROPLATING SOLUTION ANALYS...

ELECTROLYTIC COPPER PLATING SOLUTION ANALYZER, AND ELECTROLYTIC COP...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

METHOD FOR ANALYZING ELECTROLYTIC COPPER PLATING SOLUTION

Method for analyzing electrolytic copper plating solution, and anal...