Toshikazu Yajima

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate holder, plating apparatus, and plating method
- Patent number 10,316,425
- Issue date Jun 11, 2019
- Ebara Corporation
- Toshikazu Yajima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D719101
- Issue date Dec 9, 2014
- Ebara Corporation
- Masaaki Kimura
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D717736
- Issue date Nov 18, 2014
- Ebara Corporation
- Masaaki Kimura
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D706224
- Issue date Jun 3, 2014
- Ebara Corporation
- Masaaki Kimura
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HOLDER, PLATING APPARATUS, AND PLATING METHOD
- Publication number 20150247253
- Publication date Sep 3, 2015
- EBARA CORPORATION
- Toshikazu YAJIMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20090218231
- Publication date Sep 3, 2009
- Toshikazu Yajima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating device
- Publication number 20040262150
- Publication date Dec 30, 2004
- Toshikazu Yajima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR