Toshiko Nakagawa

Person

Amagasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding layer forming solution, method of producing copper-to-resin...
- Patent number 7,156,904
- Issue date Jan 2, 2007
- MEC Company Ltd.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding layer for bonding resin on copper surface
- Patent number 7,029,761
- Issue date Apr 18, 2006
- MEC Company Ltd.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminate and method of manufacturing the same
- Patent number 6,733,886
- Issue date May 11, 2004
- MEC Company Ltd.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for surface treatment of copper or copper alloys
- Patent number 6,106,899
- Issue date Aug 22, 2000
- MEC Company Limited
- Toshiko Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microetching composition for copper or copper alloy
- Patent number 5,965,036
- Issue date Oct 12, 1999
- MEC Co., Ltd.
- Yoshiro Maki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for microetching copper or copper alloy
- Patent number 5,885,476
- Issue date Mar 23, 1999
- MEC Co., Ltd.
- Yoong-koo Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microetching method for copper or copper alloy
- Patent number 5,807,493
- Issue date Sep 15, 1998
- MEC Co., Ltd.
- Yoshiro Maki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching solution for copper or copper alloy
- Patent number 5,700,389
- Issue date Dec 23, 1997
- MEC Co., Ltd.
- Toshiko Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for treating copper or copper alloy surfaces
- Patent number 5,532,094
- Issue date Jul 2, 1996
- MEC Co., Ltd.
- Maki Arimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for treating copper and copper alloy surfaces and metho...
- Patent number 5,496,590
- Issue date Mar 5, 1996
- MEC Co., Ltd.
- Yoshiro Maki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bonding layer for bonding resin on copper surface
- Publication number 20040219375
- Publication date Nov 4, 2004
- MEC COMPANY LTD.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bonding layer forming solution, method of producing copper-to-resin...
- Publication number 20040219377
- Publication date Nov 4, 2004
- MEC COMPANY LTD.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Laminate and method of manufacturing the same
- Publication number 20020192460
- Publication date Dec 19, 2002
- MEC COMPANY LTD.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Toshiko Nakagawa

Person

Patents Grantslast 30 patents

Bonding layer forming solution, method of producing copper-to-resin...

Bonding layer for bonding resin on copper surface

Laminate and method of manufacturing the same

Method for surface treatment of copper or copper alloys

Microetching composition for copper or copper alloy

Composition for microetching copper or copper alloy

Microetching method for copper or copper alloy

Etching solution for copper or copper alloy

Composition for treating copper or copper alloy surfaces

Composition for treating copper and copper alloy surfaces and metho...

Patents Applicationslast 30 patents

Bonding layer for bonding resin on copper surface

Bonding layer forming solution, method of producing copper-to-resin...

Laminate and method of manufacturing the same