Toshimi Kohmura

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Tsuchiura-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Embedding device in substrate cavity
- Patent number 8,115,307
- Issue date Feb 14, 2012
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding device in substrate cavity
- Patent number 7,592,202
- Issue date Sep 22, 2009
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Delamination reduction between vias and conductive pads
- Patent number 7,394,159
- Issue date Jul 1, 2008
- Intel Corporation
- Hideki Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package having embedded capacitors and method of fabrica...
- Patent number 6,407,929
- Issue date Jun 18, 2002
- Intel Corporation
- Aaron Dean Hale
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDING DEVICE IN SUBSTRATE CAVITY
- Publication number 20090294992
- Publication date Dec 3, 2009
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding device in substrate cavity
- Publication number 20070232050
- Publication date Oct 4, 2007
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Delamination reduction between vias and conductive pads
- Publication number 20060186537
- Publication date Aug 24, 2006
- Intel Corporation
- Hideki Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for substrate fabrication
- Publication number 20060172061
- Publication date Aug 3, 2006
- Toshimi Kohmura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR