Toshimichi Kurihara

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device in a resin sealed package with a radiating pla...
- Patent number 7,429,791
- Issue date Sep 30, 2008
- NEC Corporation
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic product with heat radiating plate
- Patent number 7,002,803
- Issue date Feb 21, 2006
- NEC Compound Semiconductor Devices, Ltd.
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid-holding frame used in production of hollow-package type electro...
- Patent number 6,956,167
- Issue date Oct 18, 2005
- NEC Compound Semiconductor Devices, Ltd.
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having pad electrode connected to wire
- Patent number 6,784,545
- Issue date Aug 31, 2004
- NEC Compound Semiconductor Devices, Ltd.
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an improved bonding pad structure and met...
- Patent number 6,507,112
- Issue date Jan 14, 2003
- NEC Compound Semiconductor Devices, Ltd.
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lid-holding frame used in production of hollow-package type electro...
- Publication number 20040042187
- Publication date Mar 4, 2004
- NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having pad electrode connected to wire
- Publication number 20030214033
- Publication date Nov 20, 2003
- NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic product with heat radiating plate
- Publication number 20030161109
- Publication date Aug 28, 2003
- NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with an improved bonding pad structure and met...
- Publication number 20020027289
- Publication date Mar 7, 2002
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020025606
- Publication date Feb 28, 2002
- NEC Corporation
- Toshimichi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS