TREA

Toshimichi Miyahara

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  • Tachikawa, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding apparatus
    • Patent number 7,842,897
    • Issue date Nov 30, 2010
    • Kabushiki Kaisha Shinkawa
    • Toshimichi Miyahara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    XY table for a semiconductor manufacturing apparatus
    • Patent number 6,727,666
    • Issue date Apr 27, 2004
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Bonding apparatus
    • Publication number 20060186839
    • Publication date Aug 24, 2006
    • KABUSHIKI KAISHA SHINKAWA
    • Toshimichi Miyahara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    XY table for a semiconductor manufacturing apparatus
    • Publication number 20020180386
    • Publication date Dec 5, 2002
    • Ryuichi Kyomasu
    • G05 - CONTROLLING REGULATING