Toshimitsu MORIYA

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder particles
- Patent number 12,172,240
- Issue date Dec 24, 2024
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HARDENER, ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTIO...
- Publication number 20240209182
- Publication date Jun 27, 2024
- Resonac Corporation
- Toshimitsu MORIYA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
- Publication number 20210229222
- Publication date Jul 29, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, AND METHOD...
- Publication number 20210114147
- Publication date Apr 22, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES
- Publication number 20210114145
- Publication date Apr 22, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR