Toshinao Shinbo

Person

Nagano-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid ejecting head and liquid ejecting apparatus
- Patent number 11,273,642
- Issue date Mar 15, 2022
- Seiko Epson Corporation
- Masanori Mikoshiba
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejecting head and liquid ejecting apparatus
- Patent number 10,926,538
- Issue date Feb 23, 2021
- Seiko Epson Corporation
- Masanori Mikoshiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing dielectric layer and method of manufacturin...
- Patent number 8,003,161
- Issue date Aug 23, 2011
- Seiko Epson Corporation
- Akira Kuriki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing liquid jet head, method of manufacturing pi...
- Patent number 7,992,972
- Issue date Aug 9, 2011
- Seiko Epson Corporation
- Toshinao Shinbo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing dielectric layer and method of manufacturin...
- Patent number 7,579,041
- Issue date Aug 25, 2009
- Seiko Epson Corporation
- Akira Kuriki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing actuator device for ink jet head
- Patent number 7,562,451
- Issue date Jul 21, 2009
- Seiko Epson Corporation
- Maki Ito
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing an actuator device
- Patent number 7,320,163
- Issue date Jan 22, 2008
- Seiko Epson Corporation
- Li Xin-Shan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Silicon wafer break pattern, silicon substrate, and method of gener...
- Patent number 6,878,609
- Issue date Apr 12, 2005
- Seiko Epson Corporation
- Akihisa Wanibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer break pattern, silicon substrate
- Patent number 6,699,552
- Issue date Mar 2, 2004
- Seiko Epson Corporation
- Akihisa Wanibe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
- Publication number 20200331267
- Publication date Oct 22, 2020
- SEIKO EPSON CORPORATION
- Masanori MIKOSHIBA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
- Publication number 20200198351
- Publication date Jun 25, 2020
- SEIKO EPSON CORPORATION
- Masanori MIKOSHIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING LIQUID JET HEAD, METHOD OF MANFUACTURING PI...
- Publication number 20090262169
- Publication date Oct 22, 2009
- SEIKO EPSON CORPORATION
- Toshinao Shinbo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MANUFACTURING DIELECTRIC LAYER AND METHOD OF MANUFACTURIN...
- Publication number 20080199599
- Publication date Aug 21, 2008
- SEIKO EPSON CORPORATION
- Akira Kuriki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing actuator device and liquid-jet apparatus
- Publication number 20070084033
- Publication date Apr 19, 2007
- Maki Ito
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of manufacturing actuator device, and liquid jet device
- Publication number 20050210645
- Publication date Sep 29, 2005
- Seiko Epson Corporation
- Li Xin-Shan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of manufacturing dielectric layer and method of manufacturin...
- Publication number 20050208208
- Publication date Sep 22, 2005
- Seiko Epson Corporation
- Akira Kuriki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silicon wafer break pattern, silicon substrate, and method of gener...
- Publication number 20040121560
- Publication date Jun 24, 2004
- Seiko Epson Corporation
- Akihisa Wanibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon wafer break pattern, silicon substrate, and method of gener...
- Publication number 20020164874
- Publication date Nov 7, 2002
- Seiko Epson Corporation
- Akihisa Wanibe
- H01 - BASIC ELECTRIC ELEMENTS

Toshinao Shinbo

Person

Patents Grantslast 30 patents

Liquid ejecting head and liquid ejecting apparatus

Liquid ejecting head and liquid ejecting apparatus

Method of manufacturing dielectric layer and method of manufacturin...

Method of manufacturing liquid jet head, method of manufacturing pi...

Method of manufacturing dielectric layer and method of manufacturin...

Method of manufacturing actuator device for ink jet head

Method of manufacturing an actuator device

Silicon wafer break pattern, silicon substrate, and method of gener...

Silicon wafer break pattern, silicon substrate

Patents Applicationslast 30 patents

LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

METHOD OF MANUFACTURING LIQUID JET HEAD, METHOD OF MANFUACTURING PI...

METHOD OF MANUFACTURING DIELECTRIC LAYER AND METHOD OF MANUFACTURIN...

Method of manufacturing actuator device and liquid-jet apparatus

Method of manufacturing actuator device, and liquid jet device

Method of manufacturing dielectric layer and method of manufacturin...

Silicon wafer break pattern, silicon substrate, and method of gener...

Silicon wafer break pattern, silicon substrate, and method of gener...