Toshinori Ogashiwa

Person

Hiratsuka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive bonding material, bonding member including the conductiv...
- Patent number 12,157,170
- Issue date Dec 3, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Gold powder, production method for gold powder, and gold paste
- Patent number 12,000,019
- Issue date Jun 4, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Through-hole sealing structure
- Patent number 11,626,334
- Issue date Apr 11, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing through-hole, and transfer substra...
- Patent number 10,870,151
- Issue date Dec 22, 2020
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Noble metal paste for bonding of semiconductor element
- Patent number 10,366,963
- Issue date Jul 30, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Masayuki Miyairi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package production method and package produced by the method
- Patent number 10,125,015
- Issue date Nov 13, 2018
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic-sealing package member, production method therefor, and he...
- Patent number 9,561,952
- Issue date Feb 7, 2017
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Precious metal paste for bonding semiconductor element
- Patent number 9,539,671
- Issue date Jan 10, 2017
- Tanaka Kikinzoku K.K.
- Masayuki Miyairi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resonator electrode material excellent in aging property, piezoelec...
- Patent number 9,065,418
- Issue date Jun 23, 2015
- Nihon Dempa Kogyo Co. Ltd.
- Toshinori Ogashiwa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,962,471
- Issue date Feb 24, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 8,912,088
- Issue date Dec 16, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal paste for sealing, hermetic sealing method for piezoelectric...
- Patent number 8,558,433
- Issue date Oct 15, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal paste for sealing, hermetic sealing method for piezoelectric...
- Patent number 8,505,804
- Issue date Aug 13, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bump, method for forming the bump, and method for mounting substrat...
- Patent number 8,492,894
- Issue date Jul 23, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding
- Patent number 7,789,287
- Issue date Sep 7, 2010
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER SUBSTRATE AND METHOD FOR PRODUCING DEVICE USING THE INTE...
- Publication number 20240321705
- Publication date Sep 26, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Koichi SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, BONDING MEMBER INCLUDING THE CONDUCTIV...
- Publication number 20230053435
- Publication date Feb 23, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD POWDER, PRODUCTION METHOD FOR GOLD POWDER, AND GOLD PASTE
- Publication number 20220219237
- Publication date Jul 14, 2022
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori OGASHIWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
THROUGH-HOLE SEALING STRUCTURE AND SEALING METHOD, AND TRANSFER SUB...
- Publication number 20220102228
- Publication date Mar 31, 2022
- TANAKA KIKINZOKU KOGYO K.K.
- Toshinori OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEALING THROUGH-HOLE, AND TRANSFER SUBSTRA...
- Publication number 20200230701
- Publication date Jul 23, 2020
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori OGASHIWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
NOBLE METAL PASTE FOR BONDING OF SEMICONDUCTOR ELEMENT
- Publication number 20180151531
- Publication date May 31, 2018
- Tanaka Kikinzoku Kogyo K.K.
- Masayuki Miyairi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE PRODUCTION METHOD AND PACKAGE PRODUCED BY THE METHOD
- Publication number 20180044175
- Publication date Feb 15, 2018
- TANAKA KIKINZOKU KOGYO K.K.
- Toshinori OGASHIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AIRTIGHT-SEALING PACKAGE MEMBER, PRODUCTION METHOD THEREFOR, AND AI...
- Publication number 20160311677
- Publication date Oct 27, 2016
- TANAKA KIKINZOKU KOGYO K.K.
- Toshinori OGASHIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USI...
- Publication number 20160272488
- Publication date Sep 22, 2016
- TANAKA KIKINZOKU KOGYO K.K.
- Toshinori OGASHIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE...
- Publication number 20150014399
- Publication date Jan 15, 2015
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20140295619
- Publication date Oct 2, 2014
- Tanaka Kikinzoku Kogyo K.K.
- TOSHINORI OGASHIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...
- Publication number 20130196504
- Publication date Aug 1, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOBLE METAL PASTE FOR BONDING OF SEMICONDUCTOR ELEMENT
- Publication number 20130168437
- Publication date Jul 4, 2013
- Masayuki Miyairi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Oscillator Electrode Material Having Excellent Aging Characteristic...
- Publication number 20120248943
- Publication date Oct 4, 2012
- Toshinori Ogashiwa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC...
- Publication number 20120212106
- Publication date Aug 23, 2012
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
- Publication number 20110272802
- Publication date Nov 10, 2011
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC...
- Publication number 20090309459
- Publication date Dec 17, 2009
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF BONDING
- Publication number 20090230172
- Publication date Sep 17, 2009
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS

Toshinori Ogashiwa

Person

Patents Grantslast 30 patents

Conductive bonding material, bonding member including the conductiv...

Gold powder, production method for gold powder, and gold paste

Through-hole sealing structure

Structure and method for sealing through-hole, and transfer substra...

Noble metal paste for bonding of semiconductor element

Transfer substrate for forming metal wiring and method for forming...

Package production method and package produced by the method

Hermetic-sealing package member, production method therefor, and he...

Precious metal paste for bonding semiconductor element

Resonator electrode material excellent in aging property, piezoelec...

Bump, method for forming the bump, and method for mounting substrat...

Transfer substrate for forming metal wiring and method for forming...

Metal paste for sealing, hermetic sealing method for piezoelectric...

Metal paste for sealing, hermetic sealing method for piezoelectric...

Bump, method for forming the bump, and method for mounting substrat...

Method of bonding

Patents Applicationslast 30 patents

INTERPOSER SUBSTRATE AND METHOD FOR PRODUCING DEVICE USING THE INTE...

CONDUCTIVE BONDING MATERIAL, BONDING MEMBER INCLUDING THE CONDUCTIV...

GOLD POWDER, PRODUCTION METHOD FOR GOLD POWDER, AND GOLD PASTE

THROUGH-HOLE SEALING STRUCTURE AND SEALING METHOD, AND TRANSFER SUB...

STRUCTURE AND METHOD FOR SEALING THROUGH-HOLE, AND TRANSFER SUBSTRA...

NOBLE METAL PASTE FOR BONDING OF SEMICONDUCTOR ELEMENT

PACKAGE PRODUCTION METHOD AND PACKAGE PRODUCED BY THE METHOD

AIRTIGHT-SEALING PACKAGE MEMBER, PRODUCTION METHOD THEREFOR, AND AI...

THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USI...

CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...

NOBLE METAL PASTE FOR BONDING OF SEMICONDUCTOR ELEMENT

Oscillator Electrode Material Having Excellent Aging Characteristic...

METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC...

BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...

METAL PASTE FOR SEALING, HERMETIC SEALING METHOD FOR PIEZOELECTRIC...

METHOD OF BONDING