Toshinori OMORI

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Probe substrate and electrical connecting apparatus
- Patent number 11,747,365
- Issue date Sep 5, 2023
- Kabushiki Kaisha Nihon Micronics
- Toshinori Omori
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer wiring board with enclosed Ur-variant dual conductive layer
- Patent number 9,622,344
- Issue date Apr 11, 2017
- Kabushiki Kaisha Nihon Micronics
- Tatsuo Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring base plate and probe card using the same
- Patent number 9,271,393
- Issue date Feb 23, 2016
- Kabushiki Kaisha Nihon Micronics
- Noboru Otabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and method for manufacturing the same
- Patent number 9,095,071
- Issue date Jul 28, 2015
- Kabushiki Kaisha Nihon Micronics
- Yoshiyuki Fukami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROBE SUBSTRATE AND ELECTRICAL CONNECTING APPARATUS
- Publication number 20220099702
- Publication date Mar 31, 2022
- Kabushiki Kaisha Nihon Micronics
- TOSHINORI OMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER WIRING BOARD AND PROCESS FOR MANUFCTURING THE SAME
- Publication number 20150107884
- Publication date Apr 23, 2015
- Kabushiki Kaisha Nihon Micronics
- Tatsuo Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140138139
- Publication date May 22, 2014
- Kabushiki Kaisha Nihon Micronics
- Yoshiyuki FUKAMI
- G01 - MEASURING TESTING
Information Patent Application
MULTILAYER WIRING BASE PLATE AND PROBE CARD USING THE SAME
- Publication number 20140118017
- Publication date May 1, 2014
- Noboru OTABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR