Toshio Enami

Person

Osaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive film for semiconductor chip with through electrode
- Patent number 10,131,826
- Issue date Nov 20, 2018
- Sekisui Chemical Co., Ltd.
- Mai Nagata
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Process for producing patterned film and photosensitive resin compo...
- Patent number 8,119,323
- Issue date Feb 21, 2012
- Sekisui Chemical Co., Ltd.
- Hiroji Fukui
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Curing resin composition, adhesive epoxy resin paste, adhesive epox...
- Patent number 7,645,514
- Issue date Jan 12, 2010
- Sekisui Chemical Co., Ltd.
- Koji Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-decaying materials, transfer sheet using the same, and pattern...
- Patent number 7,591,921
- Issue date Sep 22, 2009
- Sekisui Chemical Co., Ltd.
- Hiroji Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CURABLE RESIN COMPOSITION, ADHESIVE FOR OPTICAL LIGHT-RECEIVING AND...
- Publication number 20240376252
- Publication date Nov 14, 2024
- Sekisui Chemical Co., Ltd
- Mikitoshi SUEMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STRUCTURE AND CONSTRUCTION MATERIAL
- Publication number 20240088570
- Publication date Mar 14, 2024
- Sekisui Chemical Co., Ltd
- Hiroyuki NOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE
- Publication number 20170183548
- Publication date Jun 29, 2017
- Sekisui Chemical Co., Ltd
- Mai NAGATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPO...
- Publication number 20090202942
- Publication date Aug 13, 2009
- Hiroji Fukui
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Curing resin composition, adhesive epoxy resin paste, adhesive epox...
- Publication number 20060154078
- Publication date Jul 13, 2006
- Koji Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermally vanishing material, transfer sheet using the same, and me...
- Publication number 20050276934
- Publication date Dec 15, 2005
- Hiroji Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Toshio Enami

Person

Patents Grantslast 30 patents

Adhesive film for semiconductor chip with through electrode

Process for producing patterned film and photosensitive resin compo...

Curing resin composition, adhesive epoxy resin paste, adhesive epox...

Heat-decaying materials, transfer sheet using the same, and pattern...

Patents Applicationslast 30 patents

CURABLE RESIN COMPOSITION, ADHESIVE FOR OPTICAL LIGHT-RECEIVING AND...

STRUCTURE AND CONSTRUCTION MATERIAL

ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE

PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPO...

Curing resin composition, adhesive epoxy resin paste, adhesive epox...

Thermally vanishing material, transfer sheet using the same, and me...