Toshio Fujii

Person

Neyagawa-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having stacked chips, a re-distribution layer,...
- Patent number 9,917,066
- Issue date Mar 13, 2018
- Panasonic Corporation
- Nobuo Aoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,360,204
- Issue date Jun 7, 2016
- Panasonic Corporation
- Toshiyuki Fukuda
- F21 - LIGHTING
Information Patent Grant
Flexible substrate, multilayer flexible substrate
- Patent number 7,773,386
- Issue date Aug 10, 2010
- Panasonic Corporation
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting body and method for mounting such flip chip moun...
- Patent number 7,754,529
- Issue date Jul 13, 2010
- Panasonic Corporation
- Yoshihiro Tomita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and bump-forming process using electrica...
- Patent number 7,726,545
- Issue date Jun 1, 2010
- Panasonic Corporation
- Takashi Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate having interlaminar junctions, and process for p...
- Patent number 7,531,754
- Issue date May 12, 2009
- Panasonic Corporation
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate, multilayer flexible substrate and process for p...
- Patent number 7,321,496
- Issue date Jan 22, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with built-in circuit component and method for producing the...
- Patent number 7,248,482
- Issue date Jul 24, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate having interlaminar junctions, and process for p...
- Patent number 7,205,483
- Issue date Apr 17, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode material, dielectric material and plasma display panel us...
- Patent number 6,787,239
- Issue date Sep 7, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshio Fujii
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140327157
- Publication date Nov 6, 2014
- NOBUO AOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20140226308
- Publication date Aug 14, 2014
- PANASONIC CORPORATION
- Toshiyuki FUKUDA
- F21 - LIGHTING
Information Patent Application
FLIP CHIP MOUNTING BODY AND METHOD FOR MOUNTING SUCH FLIP CHIP MOUN...
- Publication number 20090203169
- Publication date Aug 13, 2009
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomita
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090108436
- Publication date Apr 30, 2009
- Toshio Fujii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flexible substrate, multilayer flexible substrate and process for p...
- Publication number 20080210458
- Publication date Sep 4, 2008
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip Clip Mounting Process And Bump-Forming Process Using Electrica...
- Publication number 20080165518
- Publication date Jul 10, 2008
- Takashi Ichiryu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board, method for manufacturing the same, semiconductor dev...
- Publication number 20070158838
- Publication date Jul 12, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshio Fujii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flexible substrate having interlaminar junctions, and process for p...
- Publication number 20070151756
- Publication date Jul 5, 2007
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible substrate having interlaminar junctions, and process for p...
- Publication number 20050205291
- Publication date Sep 22, 2005
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible substrate, Multilayer flexible substrate and process for p...
- Publication number 20050205294
- Publication date Sep 22, 2005
- Yoshihisa Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module with built-in circuit component and method for producing the...
- Publication number 20040226744
- Publication date Nov 18, 2004
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrode material, dielectric material and plasma display panel us...
- Publication number 20030108753
- Publication date Jun 12, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Toshio Fujii
- H01 - BASIC ELECTRIC ELEMENTS

Toshio Fujii

Person

Patents Grantslast 30 patents

Semiconductor device having stacked chips, a re-distribution layer,...

Light-emitting device

Flexible substrate, multilayer flexible substrate

Flip chip mounting body and method for mounting such flip chip moun...

Flip chip mounting process and bump-forming process using electrica...

Flexible substrate having interlaminar junctions, and process for p...

Flexible substrate, multilayer flexible substrate and process for p...

Module with built-in circuit component and method for producing the...

Flexible substrate having interlaminar junctions, and process for p...

Electrode material, dielectric material and plasma display panel us...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

LIGHT-EMITTING DEVICE

FLIP CHIP MOUNTING BODY AND METHOD FOR MOUNTING SUCH FLIP CHIP MOUN...

SEMICONDUCTOR PACKAGE

Flexible substrate, multilayer flexible substrate and process for p...

Flip Clip Mounting Process And Bump-Forming Process Using Electrica...

Circuit board, method for manufacturing the same, semiconductor dev...

Flexible substrate having interlaminar junctions, and process for p...

Flexible substrate having interlaminar junctions, and process for p...

Flexible substrate, Multilayer flexible substrate and process for p...

Module with built-in circuit component and method for producing the...

Electrode material, dielectric material and plasma display panel us...