Toshio Hatsuda

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Niihari-mura, JP

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Patents Grantslast 30 patents

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Lead frame and semiconductor device
- Patent number RE37690
- Issue date May 7, 2002
- Hitachi, Ltd.
- Makoto Kitano
- 257 - Active solid-state devices
Information Patent Grant
Heat sinks and semiconductor cooling device using the heat sinks
- Patent number 5,365,400
- Issue date Nov 15, 1994
- Hitachi, Ltd.
- Noriyuki Ashiwake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of thermal conductive members for a multi-chip mo...
- Patent number 5,276,586
- Issue date Jan 4, 1994
- Hitachi, Ltd.
- Toshio Hatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid impingement cooling module for semiconductor devices
- Patent number 5,270,572
- Issue date Dec 14, 1993
- Hitachi, Ltd.
- Tadakatsu Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 5,089,936
- Issue date Feb 18, 1992
- Hitachi, Ltd.
- Hiroyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device
- Patent number 4,942,452
- Issue date Jul 17, 1990
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS