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Toshio Kawakami
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Suita, JP
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last 30 patents
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Patent Grant
BGA package semiconductor device and inspection method therefor
Patent number
5,986,460
Issue date
Nov 16, 1999
Ricoh Company, Ltd.
Toshio Kawakami
G01 - MEASURING TESTING
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Patent Grant
IC chip mounting method
Patent number
5,048,179
Issue date
Sep 17, 1991
Ricoh Company, Ltd.
Masahiro Shindo
G06 - COMPUTING CALCULATING COUNTING