Toshio Kobayashi

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, manufacturing method therefor, and semiconductor...
- Patent number 9,603,253
- Issue date Mar 21, 2017
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 9,451,702
- Issue date Sep 20, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame including an insulating resin layer entirely covering le...
- Patent number 8,928,130
- Issue date Jan 6, 2015
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for mounting electronic components, electronic apparatus, a...
- Patent number 8,901,580
- Issue date Dec 2, 2014
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for mounting a light emitting element including a flat plat...
- Patent number 8,890,295
- Issue date Nov 18, 2014
- Shinko Electric Industries Co., Ltd.
- Toshiyuki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 8,793,868
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with electronic component incorporation substrate
- Patent number 8,482,117
- Issue date Jul 9, 2013
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, method of manufacturing the same, and semiconductor d...
- Patent number 8,379,401
- Issue date Feb 19, 2013
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor-device mounted board and method of manufacturing the...
- Patent number 8,232,639
- Issue date Jul 31, 2012
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 7,989,707
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for semiconductor device embedded substrate
- Patent number 7,985,619
- Issue date Jul 26, 2011
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device embedded substrate
- Patent number 7,981,724
- Issue date Jul 19, 2011
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device embedded substrate
- Patent number 7,915,078
- Issue date Mar 29, 2011
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, manufacturing method thereof, and semiconductor d...
- Patent number 7,901,986
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing chip integrated substrate
- Patent number 7,807,510
- Issue date Oct 5, 2010
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing chip integrated substrate
- Patent number 7,754,535
- Issue date Jul 13, 2010
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20160358858
- Publication date Dec 8, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...
- Publication number 20150201485
- Publication date Jul 16, 2015
- Shinko Electric Industries Co., Ltd.
- Tatsuaki DENDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD FOR MANUFACTURING PACKAGE
- Publication number 20130277701
- Publication date Oct 24, 2013
- Shinko Electric Industries Co., LTD.
- Toshiyuki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD...
- Publication number 20130256854
- Publication date Oct 3, 2013
- Shinko Electric Industries Co., LTD.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, A...
- Publication number 20130126916
- Publication date May 23, 2013
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120153507
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Syota MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE
- Publication number 20120013021
- Publication date Jan 19, 2012
- Shinko Electric Industries Co., LTD.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20110256662
- Publication date Oct 20, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR-DEVICE MOUNTED BOARD AND METHOD OF MANUFACTURING THE...
- Publication number 20110127656
- Publication date Jun 2, 2011
- Shinko Electric Industries Co., Ltd.
- Toshio KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD RESIN MOLDING METHOD AND MOLD RESIN MOLDING APPARATUS
- Publication number 20100155992
- Publication date Jun 24, 2010
- Shinko Electric Industries Co., Ltd.
- Nobuyuki Kurashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
- Publication number 20100112804
- Publication date May 6, 2010
- Shinko Electric Industries Co., Ltd.
- Toshio KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
- Publication number 20100112759
- Publication date May 6, 2010
- Shinko Electric Industries Co., Ltd.
- Toshio KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
- Publication number 20100112802
- Publication date May 6, 2010
- Shinko Electric Industries Co., Ltd.
- Toshio KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
- Publication number 20100025081
- Publication date Feb 4, 2010
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR D...
- Publication number 20090052150
- Publication date Feb 26, 2009
- Shinko Electric Industries Co,, LTD.
- Toshio KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090008765
- Publication date Jan 8, 2009
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CHIP INTEGRATED SUBSTRATE
- Publication number 20080293189
- Publication date Nov 27, 2008
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Toshio KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CHIP INTEGRATED SUBSTRATE
- Publication number 20080293236
- Publication date Nov 27, 2008
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Toshio KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20080182400
- Publication date Jul 31, 2008
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate, manufacturing method thereof, and semiconductor d...
- Publication number 20080155820
- Publication date Jul 3, 2008
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- H01 - BASIC ELECTRIC ELEMENTS

Toshio Kobayashi

Person

Patents Grantslast 30 patents

Electronic part embedded substrate and method of producing an elect...

Electronic part embedded substrate and method of producing an elect...

Wiring substrate, manufacturing method therefor, and semiconductor...

Chip embedded substrate and method of producing the same

Lead frame including an insulating resin layer entirely covering le...

Package for mounting electronic components, electronic apparatus, a...

Package for mounting a light emitting element including a flat plat...

Chip embedded substrate and method of producing the same

Semiconductor device with electronic component incorporation substrate

Wiring board, method of manufacturing the same, and semiconductor d...

Semiconductor-device mounted board and method of manufacturing the...

Chip embedded substrate and method of producing the same

Manufacturing method for semiconductor device embedded substrate

Manufacturing method for semiconductor device embedded substrate

Manufacturing method for semiconductor device embedded substrate

Wiring substrate, manufacturing method thereof, and semiconductor d...

Method of manufacturing chip integrated substrate

Method of manufacturing chip integrated substrate

Patents Applicationslast 30 patents

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

PACKAGE AND METHOD FOR MANUFACTURING PACKAGE

LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD...

PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, A...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDCUTOR DEVICE

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR-DEVICE MOUNTED BOARD AND METHOD OF MANUFACTURING THE...

MOLD RESIN MOLDING METHOD AND MOLD RESIN MOLDING APPARATUS

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE

WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE

WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR D...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

METHOD OF MANUFACTURING CHIP INTEGRATED SUBSTRATE

METHOD OF MANUFACTURING CHIP INTEGRATED SUBSTRATE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Wiring substrate, manufacturing method thereof, and semiconductor d...