Toshio Matsuzaki

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin mold package structure of integrated circuit
- Patent number 5,264,730
- Issue date Nov 23, 1993
- Fujitsu Limited
- Toshio Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package structure
- Patent number 4,994,895
- Issue date Feb 19, 1991
- Fujitsu Limited
- Toshio Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS