Toshio Yokouchi

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Kofu-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and fabrication method thereof
- Patent number 8,896,132
- Issue date Nov 25, 2014
- Pioneer Corporation
- Naoki Noda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding semiconductor substrate and MEMS device
- Patent number 8,592,285
- Issue date Nov 26, 2013
- Pioneer Corporation
- Naoki Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20130207277
- Publication date Aug 15, 2013
- PIONEER MICRO TECHNOLOGY CORPORATION
- Naoki Noda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
- Publication number 20120319220
- Publication date Dec 20, 2012
- PIONEER MICRO TECHNOLOGY CORPORATION
- Naoki Noda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
- Publication number 20120306032
- Publication date Dec 6, 2012
- PIONEER MICRO TECHNOLOGY CORPORATION
- Naoki Noda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
- Publication number 20120299128
- Publication date Nov 29, 2012
- PIONEER MICRO TECHNOLOGY CORPORATION
- Naoki Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR