Toshio Yoshimura

Follow

Person

Fukuoka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, adhesive film for semiconductor device, and lami...
- Patent number 6,783,828
- Issue date Aug 31, 2004
- Toray Industries Inc.
- Koichi Fujimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Heat-resistant resin film with metal layer and wiring board, and me...
- Publication number 20030170431
- Publication date Sep 11, 2003
- Masahiro Oguni
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition, adhesive film for semiconductor device, and lami...
- Publication number 20030035948
- Publication date Feb 20, 2003
- Koichi Fujimaru
- B32 - LAYERED PRODUCTS