Toshiro Doi

Person

Tokorozawa-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Work processing apparatus
- Patent number 12,257,641
- Issue date Mar 25, 2025
- Toshiro DOI
- Hideo Aida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing pad and polishing method
- Patent number 9,956,669
- Issue date May 1, 2018
- Kyushu University, National University Corporation
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for chemical mechanical polishing
- Patent number 7,785,175
- Issue date Aug 31, 2010
- Tokyo Seimitsu Co., Ltd.
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and method of polishing work piece
- Patent number 7,195,546
- Issue date Mar 27, 2007
- Fujikoshi Machinery Corp.
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and method of polishing work piece
- Patent number 7,070,486
- Issue date Jul 4, 2006
- Toshiro DOY
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for chemical and mechanical polishing
- Patent number 6,969,308
- Issue date Nov 29, 2005
- Tokyo Seimitsu Co., Ltd.
- Toshiro Doi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
WORK PROCESSING APPARATUS
- Publication number 20220297223
- Publication date Sep 22, 2022
- National University Corporation Nagaoka University of Technology
- Hideo AIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLISHING PAD AND POLISHING METHOD
- Publication number 20160016292
- Publication date Jan 21, 2016
- KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- Toshiro DOI
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and method of polishing work piece
- Publication number 20060217039
- Publication date Sep 28, 2006
- Toshiro Doi
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for chemical mechanical polishing
- Publication number 20050205433
- Publication date Sep 22, 2005
- TOKYO SEIMITSU CO., LTD.
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Application
Method of conditioning polishing pad for semiconductor wafer
- Publication number 20050164613
- Publication date Jul 28, 2005
- ASAHI SUNAC CORPORATION
- Yoshiyuki Seike
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and method of polishing work piece
- Publication number 20050113007
- Publication date May 26, 2005
- Fujikoshi Machinery Corp.
- Toshiro Doi
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for chemical and mechanical polishing
- Publication number 20040009738
- Publication date Jan 15, 2004
- TOKYO SEIMITSU CO., LTD.
- Toshiro Doi
- B24 - GRINDING POLISHING

Toshiro Doi

Person

Patents Grantslast 30 patents

Work processing apparatus

Polishing pad and polishing method

Method and apparatus for chemical mechanical polishing

Polishing apparatus and method of polishing work piece

Polishing apparatus and method of polishing work piece

Method and apparatus for chemical and mechanical polishing

Patents Applicationslast 30 patents

WORK PROCESSING APPARATUS

POLISHING PAD AND POLISHING METHOD

Polishing apparatus and method of polishing work piece

Method and apparatus for chemical mechanical polishing

Method of conditioning polishing pad for semiconductor wafer

Polishing apparatus and method of polishing work piece

Method and apparatus for chemical and mechanical polishing