Toshiro Okamura

Person

Tochigi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing multilayer printed wiring board
- Patent number 5,826,330
- Issue date Oct 27, 1998
- Hitachi Aic Inc.
- Satoshi Isoda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing multiple wire wiring board
- Patent number 5,584,121
- Issue date Dec 17, 1996
- Hitachi Chemical Company, Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multiple wire adhesive on a multiple wire wiring board
- Patent number 5,486,655
- Issue date Jan 23, 1996
- Hitachi Chemical Co., Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoini...
- Patent number 5,403,869
- Issue date Apr 4, 1995
- Hitachi Chemical Company, Ltd.
- Shigeharu Arike
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing coaxial conductor interconnection wiring board
- Patent number 5,323,534
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Yorio Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial conductor interconnection wiring board
- Patent number 5,233,133
- Issue date Aug 3, 1993
- Hitachi Chemical Company Ltd.
- Yorio Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed wiring boards
- Patent number 5,153,987
- Issue date Oct 13, 1992
- Hitachi Chemical Company, Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition for printed wiring boards with acrylonitrile-b...
- Patent number 5,053,280
- Issue date Oct 1, 1991
- Hitachi Chemical Co., Ltd.
- Shin Takanezawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for treating copper surface
- Patent number 4,902,551
- Issue date Feb 20, 1990
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for metallizing glass surface
- Patent number 4,859,505
- Issue date Aug 22, 1989
- Hitachi Chemical Co., Ltd.
- Hajime Nakayama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for forming metallic film on inorganic material
- Patent number 4,842,899
- Issue date Jun 27, 1989
- Hitachi Chemical Co., Ltd.
- Yoshiyuki Tsuru
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for treating metal surface
- Patent number 4,643,793
- Issue date Feb 17, 1987
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution
- Patent number 4,557,762
- Issue date Dec 10, 1985
- Hitachi Chemical Company
- Akishi Nakaso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper deposition solution
- Patent number 4,548,644
- Issue date Oct 22, 1985
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving adhesion between insulating substrates and meta...
- Patent number 4,216,246
- Issue date Aug 5, 1980
- Hitachi Chemical Company, Ltd.
- Yorio Iwasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Toshiro Okamura

Person

Patents Grantslast 30 patents

Method of manufacturing multilayer printed wiring board

Process for producing multiple wire wiring board

Multiple wire adhesive on a multiple wire wiring board

Adhesive of epoxy resins, epoxy-modified polybutadiene and photoini...

Process for producing coaxial conductor interconnection wiring board

Coaxial conductor interconnection wiring board

Process for producing printed wiring boards

Adhesive composition for printed wiring boards with acrylonitrile-b...

Process for treating copper surface

Process for metallizing glass surface

Process for forming metallic film on inorganic material

Process for treating metal surface

Electroless copper plating solution

Electroless copper deposition solution

Method of improving adhesion between insulating substrates and meta...