Toshitada Netsu

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Hadano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Sealing structure for multi-chip module
- Patent number 7,518,233
- Issue date Apr 14, 2009
- Hitachi, Ltd.
- Kouichi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,890,799
- Issue date May 10, 2005
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,528,878
- Issue date Mar 4, 2003
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for mounting a semiconductor device and a capacitor devic...
- Patent number 6,272,020
- Issue date Aug 7, 2001
- Hitachi, Ltd.
- Hiromi Tosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit apparatus comprising a structure for sealing an...
- Patent number 5,151,773
- Issue date Sep 29, 1992
- Hitachi, Ltd.
- Kiyoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device, method of connecting with solder and sol...
- Patent number 5,136,360
- Issue date Aug 4, 1992
- Hitachi, Ltd.
- Masahide Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Device for sealing and cooling multi-chip modules
- Publication number 20030103333
- Publication date Jun 5, 2003
- Hitachi, Ltd
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS