Toshitaka AKAHOSHI

Person

Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laminated semiconductor device
- Patent number 10,109,660
- Issue date Oct 23, 2018
- Panasonic Corporation
- Shigefumi Dohi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical apparatus having resin encased stacked optical and semicond...
- Patent number 9,502,455
- Issue date Nov 22, 2016
- Panasonic Corporation
- Toshitaka Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip semiconductor device and method for manufacturing the...
- Patent number 7,521,288
- Issue date Apr 21, 2009
- Panasonic Corporation
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 7,298,045
- Issue date Nov 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hisaki Fujitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip semiconductor device and method for manufacturing the...
- Patent number 7,239,021
- Issue date Jul 3, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATED SEMICONDUCTOR DEVICE
- Publication number 20150333096
- Publication date Nov 19, 2015
- PANASONIC CORPORATION
- SHIGEFUMI DOHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL APPARATUS AND METHOD FOR MANUFACTURING SAME
- Publication number 20150255500
- Publication date Sep 10, 2015
- PANASONIC CORPORATION
- TOSHITAKA AKAHOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100127382
- Publication date May 27, 2010
- Toshitaka AKAHOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20100044880
- Publication date Feb 25, 2010
- Isamu AOKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICON...
- Publication number 20090091039
- Publication date Apr 9, 2009
- Matsushita Electric Industrial Co., Ltd.
- Toshitaka Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked chip semiconductor device and method for manufacturing the...
- Publication number 20070187811
- Publication date Aug 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor package
- Publication number 20060220207
- Publication date Oct 5, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshitaka Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor device and manufacturing method of the same
- Publication number 20060202793
- Publication date Sep 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshitaka Akahoshi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20050116353
- Publication date Jun 2, 2005
- Matsushita Elec. Ind. Co. Ltd.
- Hisaki Fujitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked chip semiconductor device and method for manufacturing the...
- Publication number 20050003580
- Publication date Jan 6, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS

Toshitaka AKAHOSHI

Person

Patents Grantslast 30 patents

Laminated semiconductor device

Optical apparatus having resin encased stacked optical and semicond...

Stacked chip semiconductor device and method for manufacturing the...

Stacked semiconductor device

Stacked chip semiconductor device and method for manufacturing the...

Patents Applicationslast 30 patents

LAMINATED SEMICONDUCTOR DEVICE

OPTICAL APPARATUS AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICON...

Stacked chip semiconductor device and method for manufacturing the...

Stacked semiconductor package

Image sensor device and manufacturing method of the same

Semiconductor device and fabrication method thereof

Stacked chip semiconductor device and method for manufacturing the...