Toshitsune Iijima

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a semiconductor device and a semiconductor...
- Patent number 8,673,690
- Issue date Mar 18, 2014
- Kabushiki Kaisha Toshiba
- Toshitsune Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a semiconductor wafer utilizing a laser dicing t...
- Patent number 7,138,297
- Issue date Nov 21, 2006
- Kabushiki Kaisha Toshiba
- Toshitsune Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device obtained by dividing semiconductor wafer by us...
- Patent number 7,091,624
- Issue date Aug 15, 2006
- Kabushiki Kaisha Toshiba
- Toshitsune Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring pattern of semiconductor device
- Patent number 6,713,869
- Issue date Mar 30, 2004
- Kabushiki Kaisha Toshiba
- Takeshi Kusakabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number D473198
- Issue date Apr 15, 2003
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device of surface mounting type and method for fabric...
- Patent number 6,429,372
- Issue date Aug 6, 2002
- Kabushiki Kaisha Toshiba
- Hideo Taguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20110221066
- Publication date Sep 15, 2011
- Kazuhiro WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20110215461
- Publication date Sep 8, 2011
- Toshitsune Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100213599
- Publication date Aug 26, 2010
- Kabushiki Kaisha Toshiba
- Kazuhiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device obtained by dividing semiconductor wafer by us...
- Publication number 20050017326
- Publication date Jan 27, 2005
- Kabushiki Kaisha Toshiba
- Toshitsune Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer having separation groove on insulating film on...
- Publication number 20040169258
- Publication date Sep 2, 2004
- Kabushiki Kaisha Toshiba
- Toshitsune Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
First and second level packaging assemblies and method of assemblin...
- Publication number 20040155358
- Publication date Aug 12, 2004
- Toshitsune Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device obtained by dividing semiconductor wafer by us...
- Publication number 20040137702
- Publication date Jul 15, 2004
- Toshitsune Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring pattern of semiconductor device
- Publication number 20030071364
- Publication date Apr 17, 2003
- Takeshi Kusakabe
- H01 - BASIC ELECTRIC ELEMENTS

Toshitsune Iijima

Person

Patents Grantslast 30 patents

Method for manufacturing a semiconductor device and a semiconductor...

Method of dividing a semiconductor wafer utilizing a laser dicing t...

Semiconductor device obtained by dividing semiconductor wafer by us...

Wiring pattern of semiconductor device

Semiconductor device

Semiconductor device of surface mounting type and method for fabric...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device obtained by dividing semiconductor wafer by us...

Semiconductor wafer having separation groove on insulating film on...

First and second level packaging assemblies and method of assemblin...

Semiconductor device obtained by dividing semiconductor wafer by us...

Wiring pattern of semiconductor device