TOSHIYASU KAWAI

Person

ICHIHARA-SHI, CHIBA, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermoplastic resin composition for semiconductor, adhesion film, l...
- Patent number 7,843,045
- Issue date Nov 30, 2010
- Hitachi Chemical Co., Ltd.
- Kiyohide Tateoka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 7,479,412
- Issue date Jan 20, 2009
- Hitachi Chemical Company, Ltd.
- Toshiyasu Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, metal sheet with such adhesive fil...
- Patent number 7,449,367
- Issue date Nov 11, 2008
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 7,378,722
- Issue date May 27, 2008
- Hitachi Chemical Co., Ltd.
- Toshiyasu Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 7,057,266
- Issue date Jun 6, 2006
- Hitachi Chemical Co., Ltd.
- Toshiyasu Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 6,700,185
- Issue date Mar 2, 2004
- Hitachi Chemical Co., Ltd.
- Toshiyasu Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film of quinoline polymer and bismaleimide
- Patent number 6,462,148
- Issue date Oct 8, 2002
- Hitachi Chemical Co., Ltd.
- Masahiro Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Transparent resin and plastic lens
- Patent number 5,663,264
- Issue date Sep 2, 1997
- Hitachi Chemical Company, Ltd.
- Toshiyasu Kawai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plastic lens
- Patent number 5,583,191
- Issue date Dec 10, 1996
- Hitachi Chemical Company, Ltd.
- Toshiyasu Kawai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, L...
- Publication number 20090091012
- Publication date Apr 9, 2009
- Kiyohide Tateoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADH...
- Publication number 20090053498
- Publication date Feb 26, 2009
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME AND SEMICONDUCTOR DEVIC...
- Publication number 20080194062
- Publication date Aug 14, 2008
- Toshiyasu Kawai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Publication number 20060138616
- Publication date Jun 29, 2006
- Toshiyasu Kawai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive film for semiconductor, metal sheet with such adhesive fil...
- Publication number 20060043607
- Publication date Mar 2, 2006
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Publication number 20040124544
- Publication date Jul 1, 2004
- Toshiyasu Kawai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION AND ADHESIVE FILM
- Publication number 20020151659
- Publication date Oct 17, 2002
- MASAHIRO SUZUKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

TOSHIYASU KAWAI

Person

Patents Grantslast 30 patents

Thermoplastic resin composition for semiconductor, adhesion film, l...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, metal sheet with such adhesive fil...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film of quinoline polymer and bismaleimide

Transparent resin and plastic lens

Plastic lens

Patents Applicationslast 30 patents

THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, L...

ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADH...

ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME AND SEMICONDUCTOR DEVIC...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, metal sheet with such adhesive fil...

Adhesive film for semiconductor, lead frame and semiconductor devic...

RESIN COMPOSITION AND ADHESIVE FILM