Toshiyasu Yajima

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Shinagawa-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for polishing using polishing pad provided with adsorption l...
- Patent number 11,602,819
- Issue date Mar 14, 2023
- Maruishi Sangyo Co., Ltd.
- Toshiyasu Yajima
- B24 - GRINDING POLISHING
Information Patent Grant
Holding pad
- Patent number 10,449,653
- Issue date Oct 22, 2019
- MARUISHI SANGYO CO. LTD.
- Toshiyasu Yajima
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad
- Patent number 8,430,719
- Issue date Apr 30, 2013
- Kuraray Co., Ltd.
- Takashi Katayama
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SURFACE PLATE FOR POLISHING DEVICE, AND POLISHING DEVICE AND POLISH...
- Publication number 20220063052
- Publication date Mar 3, 2022
- MARUISHI SANGYO CO., LTD.
- MATSUO IIDA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING USING POLISHING PAD PROVIDED WITH ADSORPTION L...
- Publication number 20200147749
- Publication date May 14, 2020
- MARUISHI SANGYO CO., LTD.
- TOSHIYASU YAJIMA
- B24 - GRINDING POLISHING
Information Patent Application
HOLDING PAD
- Publication number 20170259397
- Publication date Sep 14, 2017
- MARUISHI SANGYO CO., LTD.
- TOSHIYASU YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD
- Publication number 20120196515
- Publication date Aug 2, 2012
- MARUISHI SANGYO CO., LTD.
- Takashi KATAYAMA
- D03 - WEAVING