Toshiyuki Arai

Person

Machida, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,977,234
- Issue date Jul 12, 2011
- Renesas Electronics Corporation
- Toshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,718,526
- Issue date May 18, 2010
- Renesas Technology Corporation
- Toshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for treating solid surface and substrate surface
- Patent number 7,264,677
- Issue date Sep 4, 2007
- Renesas Technology Corp.
- Miwako Nakahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 7,250,365
- Issue date Jul 31, 2007
- Renesas Technology Corp.
- Toshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for treating solid surface and substrate surface
- Patent number 7,025,896
- Issue date Apr 11, 2006
- Renesas Technology Corp.
- Miwako Nakahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication method of semiconductor integrated circuit device
- Patent number 6,979,649
- Issue date Dec 27, 2005
- Renesas Technology Corp.
- Toshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for treating solid surface and substrate surface
- Patent number 6,613,242
- Issue date Sep 2, 2003
- Miwako Nakahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 6,607,988
- Issue date Aug 19, 2003
- Hitachi, Ltd.
- Takashi Yunogami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for treating solid surface and substrate surface
- Patent number 6,537,461
- Issue date Mar 25, 2003
- Hitachi, Ltd.
- Miwako Nakahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100227474
- Publication date Sep 9, 2010
- Toshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20070259522
- Publication date Nov 8, 2007
- Toshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for treating solid surface and substrate surface
- Publication number 20060037627
- Publication date Feb 23, 2006
- Miwako Nakahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20050250331
- Publication date Nov 10, 2005
- Toshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for treating solid surface and substrate surface
- Publication number 20030205553
- Publication date Nov 6, 2003
- Miwako Nakahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor treating apparatus and cleaning method of the same
- Publication number 20030037802
- Publication date Feb 27, 2003
- Hitachi, Ltd
- Miwako Nakahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fabrication method of semiconductor integrated circuit device
- Publication number 20020160610
- Publication date Oct 31, 2002
- Toshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for treating solid surface and substrate surface
- Publication number 20020070194
- Publication date Jun 13, 2002
- Miwako Nakahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic circuit board with built-in thin film capacitor and manu...
- Publication number 20010026444
- Publication date Oct 4, 2001
- Naoki Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of semiconductor integrated circuit device
- Publication number 20010006245
- Publication date Jul 5, 2001
- Takashi Yunogami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Toshiyuki Arai

Person

Patents Grantslast 30 patents

Fabrication method of semiconductor integrated circuit device

Fabrication method of semiconductor integrated circuit device

Process for treating solid surface and substrate surface

Fabrication method of semiconductor integrated circuit device

Process for treating solid surface and substrate surface

Fabrication method of semiconductor integrated circuit device

Process for treating solid surface and substrate surface

Manufacturing method of semiconductor integrated circuit device

Process for treating solid surface and substrate surface

Patents Applicationslast 30 patents

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Fabrication method of semiconductor integrated circuit device

Process for treating solid surface and substrate surface

Fabrication method of semiconductor integrated circuit device

Process for treating solid surface and substrate surface

Semiconductor treating apparatus and cleaning method of the same

Fabrication method of semiconductor integrated circuit device

Process for treating solid surface and substrate surface

Electronic circuit board with built-in thin film capacitor and manu...

Manufacturing method of semiconductor integrated circuit device