Toshiyuki INAOKA

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Ishikawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,096,564
- Issue date Oct 9, 2018
- J-DEVICES CORPORATION
- Toshiyuki Inaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, method of producing the same, and semi...
- Patent number 9,717,142
- Issue date Jul 25, 2017
- Toshiyuki Inaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170317045
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Toshiyuki INAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE, METHOD OF PRODUCING THE SAME, AND SEMI...
- Publication number 20150029677
- Publication date Jan 29, 2015
- SONY CORPORATION
- Toshiyuki INAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR