Toshiyuki Koyama

Follow

Person

Yamanashi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for mounting electronic component
- Patent number 9,867,320
- Issue date Jan 9, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus
- Patent number 6,915,561
- Issue date Jul 12, 2005
- Matsushita Electric Industrial Co., Ltd.
- Dai Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting a wire component
- Patent number 6,715,205
- Issue date Apr 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus and device for detecting attachment on...
- Patent number 6,609,295
- Issue date Aug 26, 2003
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20150128411
- Publication date May 14, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Hideaki WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20150128410
- Publication date May 14, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Hideaki WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring and piping apparatus of part mounting machine
- Publication number 20060016614
- Publication date Jan 26, 2006
- Dai Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting apparatus
- Publication number 20020108237
- Publication date Aug 15, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Dai Yokoyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Apparatus and method for mounting wire component
- Publication number 20020046463
- Publication date Apr 25, 2002
- Hideaki Watanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC