Toshiyuki Nagase

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic-aluminum conjugate, power module substrate, and power module
- Patent number 10,607,907
- Issue date Mar 31, 2020
- Mitsubishi Materials Corporation
- Yoshirou Kuromitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoelectric conversion module and thermoelectric conversion device
- Patent number 10,573,798
- Issue date Feb 25, 2020
- Mitsubishi Materials Corporation
- Yoshinobu Nakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor and method for manufacturing resistor
- Patent number 10,121,574
- Issue date Nov 6, 2018
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor and method for manufacturing resistor
- Patent number 10,037,837
- Issue date Jul 31, 2018
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-module substrate and manufacturing method thereof
- Patent number 9,862,045
- Issue date Jan 9, 2018
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module substrate, heat-sink-attached power module substrate,...
- Patent number 9,764,416
- Issue date Sep 19, 2017
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 9,642,275
- Issue date May 2, 2017
- Mitsubishi Materials Corporation
- Touyou Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 9,426,915
- Issue date Aug 23, 2016
- Mitsubishi Materials Corporation
- Touyou Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and ceramic circuit substrate, and producing m...
- Patent number 9,401,340
- Issue date Jul 26, 2016
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Power module substrate with heat sink, and method for producing pow...
- Patent number 9,237,682
- Issue date Jan 12, 2016
- Mitsubishi Materials Corporation
- Yoshiyuki Nagatomo
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Insulation substrate, power module substrate, manufacturing method...
- Patent number 8,188,376
- Issue date May 29, 2012
- Mitsubishi Materials Corporation
- Takeshi Negishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Al/AlN joint material, base plate for power module, power module, a...
- Patent number 8,164,909
- Issue date Apr 24, 2012
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing power module substrate, power module subst...
- Patent number 8,116,084
- Issue date Feb 14, 2012
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation substrate, power module substrate, manufacturing method...
- Patent number 8,001,682
- Issue date Aug 23, 2011
- Mitsubishi Materials Corporation
- Takeshi Negishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Al/AlN joint material, base plate for power module, power module, a...
- Patent number 7,532,481
- Issue date May 12, 2009
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method of producing same, and power module
- Patent number 7,128,979
- Issue date Oct 31, 2006
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module and power module with heat sink
- Patent number 7,019,975
- Issue date Mar 28, 2006
- Mitsubishi Materials Corporation
- Yoshiyuki Nagatomo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooled heat sink and manufacturing method thereof
- Patent number 6,563,709
- Issue date May 13, 2003
- Mitsubishi Materials Corporation
- Takeshi Negishi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module substrate, method of producing the same, and semicondu...
- Patent number 6,483,185
- Issue date Nov 19, 2002
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module substrate
- Patent number 6,310,775
- Issue date Oct 30, 2001
- Mitsubishi Materials Corporation
- Yoshiyuki Nagatomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board with heat sink
- Patent number 6,033,787
- Issue date Mar 7, 2000
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- B32 - LAYERED PRODUCTS
Information Patent Grant
Highly heat-radiating ceramic package
- Patent number 5,675,474
- Issue date Oct 7, 1997
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate used for fabrication of thick film circuit
- Patent number 5,096,768
- Issue date Mar 17, 1992
- Mitsubishi Metal Corporation
- Yoshirou Kuromitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate used for fabrication of thick film circuit
- Patent number 5,087,509
- Issue date Feb 11, 1992
- Mitsubishi Metal Corporation
- Yoshirou Kuromitsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL LAYER-INCLUDING CARBONACEOUS MEMBER AND HEAT CONDUCTION PLATE
- Publication number 20210352828
- Publication date Nov 11, 2021
- MITSUBISHI MATERIALS CORPORATION
- Koichi Kita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION DEVICE
- Publication number 20190044042
- Publication date Feb 7, 2019
- MITSUBISHI MATERIALS CORPORATION
- Yoshinobu Nakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC-ALUMINUM CONJUGATE, POWER MODULE SUBSTRATE, AND POWER MODULE
- Publication number 20180323122
- Publication date Nov 8, 2018
- MITSUBISHI MATERIALS CORPORATION
- Yoshirou Kuromitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE SUBSTRATE, LIGHT-EMITTING MODULE, SUBSTRATE F...
- Publication number 20180277729
- Publication date Sep 27, 2018
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMISSION MODULE HAVING COOLER AND PRODUCTION METHOD FOR LIGHT...
- Publication number 20180277730
- Publication date Sep 27, 2018
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki NAGASE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESISTOR AND METHOD FOR MANUFACTURING RESISTOR
- Publication number 20180012685
- Publication date Jan 11, 2018
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR AND METHOD FOR MANUFACTURING RESISTOR
- Publication number 20160336099
- Publication date Nov 17, 2016
- MITSUBISHI MATERIAL CORPORATION
- Toshiyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE,...
- Publication number 20150366048
- Publication date Dec 17, 2015
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER-MODULE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20150328706
- Publication date Nov 19, 2015
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- B32 - LAYERED PRODUCTS
Information Patent Application
POWER MODULE
- Publication number 20150319877
- Publication date Nov 5, 2015
- MITSUBISHI MATERIALS CORPORATION
- Touyou Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20150319876
- Publication date Nov 5, 2015
- Mitsubishi Materials Corporation
- Touyou Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND CERAMIC CIRCUIT SUBSTRATE, AND PRODUCING M...
- Publication number 20150255419
- Publication date Sep 10, 2015
- MITSUBISHI MATERIALS CORPORATION
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SUBSTRATE WITH HEAT SINK, AND METHOD FOR PRODUCING POW...
- Publication number 20150055303
- Publication date Feb 26, 2015
- Yoshiyuki Nagatomo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...
- Publication number 20140318831
- Publication date Oct 30, 2014
- Kimihito Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR POWER MODULE AND POWER MODULE
- Publication number 20120298408
- Publication date Nov 29, 2012
- MITSUBISHI MATERIALS CORPORATION
- Yoshiyuki Nagatomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE, POWER MODULE SUBST...
- Publication number 20100285331
- Publication date Nov 11, 2010
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...
- Publication number 20100230473
- Publication date Sep 16, 2010
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION SUBSTRATE, POWER MODULE SUBSTRATE, MANUFACTURING METHOD...
- Publication number 20100053903
- Publication date Mar 4, 2010
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Negishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...
- Publication number 20080248326
- Publication date Oct 9, 2008
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulation Substrate, Power Module Substrate, Manufacturing Method...
- Publication number 20070297162
- Publication date Dec 27, 2007
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Negishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ai/Ain Joint Material, Base Plate For Power Module, Power Module, A...
- Publication number 20070274047
- Publication date Nov 29, 2007
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board, process for producing the same, and power module
- Publication number 20050214518
- Publication date Sep 29, 2005
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-conducting multilayer substrate and power module substrate
- Publication number 20040188828
- Publication date Sep 30, 2004
- MITSUBISHI MATERIALS CORPORATION
- Yoshiyuki Nagatomo
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Power module and power module with heat sink
- Publication number 20040022029
- Publication date Feb 5, 2004
- Yoshiyuki Nagatomo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid-cooled heat sink and manufacturing method thereof
- Publication number 20020101718
- Publication date Aug 1, 2002
- Takeshi Negishi
- F28 - HEAT EXCHANGE IN GENERAL

Toshiyuki Nagase

Person

Patents Grantslast 30 patents

Ceramic-aluminum conjugate, power module substrate, and power module

Thermoelectric conversion module and thermoelectric conversion device

Resistor and method for manufacturing resistor

Resistor and method for manufacturing resistor

Power-module substrate and manufacturing method thereof

Power module substrate, heat-sink-attached power module substrate,...

Power module

Power module

Semiconductor device and ceramic circuit substrate, and producing m...

Power module substrate with heat sink, and method for producing pow...

Insulation substrate, power module substrate, manufacturing method...

Al/AlN joint material, base plate for power module, power module, a...

Method for manufacturing power module substrate, power module subst...

Insulation substrate, power module substrate, manufacturing method...

Al/AlN joint material, base plate for power module, power module, a...

Circuit board, method of producing same, and power module

Power module and power module with heat sink

Liquid-cooled heat sink and manufacturing method thereof

Power module substrate, method of producing the same, and semicondu...

Power module substrate

Ceramic circuit board with heat sink

Highly heat-radiating ceramic package

Substrate used for fabrication of thick film circuit

Substrate used for fabrication of thick film circuit

Patents Applicationslast 30 patents

METAL LAYER-INCLUDING CARBONACEOUS MEMBER AND HEAT CONDUCTION PLATE

THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION DEVICE

CERAMIC-ALUMINUM CONJUGATE, POWER MODULE SUBSTRATE, AND POWER MODULE

LIGHT-EMITTING MODULE SUBSTRATE, LIGHT-EMITTING MODULE, SUBSTRATE F...

LIGHT-EMISSION MODULE HAVING COOLER AND PRODUCTION METHOD FOR LIGHT...

RESISTOR AND METHOD FOR MANUFACTURING RESISTOR

RESISTOR AND METHOD FOR MANUFACTURING RESISTOR

POWER MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE,...

POWER-MODULE SUBSTRATE AND MANUFACTURING METHOD THEREOF

POWER MODULE

POWER MODULE

SEMICONDUCTOR DEVICE AND CERAMIC CIRCUIT SUBSTRATE, AND PRODUCING M...

POWER MODULE SUBSTRATE WITH HEAT SINK, AND METHOD FOR PRODUCING POW...

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...

SUBSTRATE FOR POWER MODULE AND POWER MODULE

METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE, POWER MODULE SUBST...

Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...

INSULATION SUBSTRATE, POWER MODULE SUBSTRATE, MANUFACTURING METHOD...

AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...

Insulation Substrate, Power Module Substrate, Manufacturing Method...

Ai/Ain Joint Material, Base Plate For Power Module, Power Module, A...

Circuit board, process for producing the same, and power module

Heat-conducting multilayer substrate and power module substrate

Power module and power module with heat sink

Liquid-cooled heat sink and manufacturing method thereof