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Toshiyuki Nakamura
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Suzaka-shi, JP
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Patents Grants
last 30 patents
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Patent Grant
Process for producing a collapsed filled via hole
Patent number
7,178,233
Issue date
Feb 20, 2007
Mitsui Mining & Smelting Co., Ltd.
Toshiyuki Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Process for producing a printed wiring board-forming sheet and mult...
Publication number
20040111882
Publication date
Jun 17, 2004
Toshiyuki Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR