Toshiyuki OMORI

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Suwa-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thermally conductive composition
- Patent number 10,779,450
- Issue date Sep 15, 2020
- KITAGAWA INDUSTRIES CO., LTD.
- Toru Matsuzaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed circuit board, electronic device and heat conduction sheet
- Patent number 10,631,397
- Issue date Apr 21, 2020
- Seiko Epson Corporation
- Masaaki Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS
- Publication number 20240114618
- Publication date Apr 4, 2024
- SEIKO EPSON CORPORATION
- Yu MASAGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND HEAT CONDUCTION SHEET
- Publication number 20200137870
- Publication date Apr 30, 2020
- SEIKO EPSON CORPORATION
- Masaaki ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally Conductive Composition
- Publication number 20200022291
- Publication date Jan 16, 2020
- KITAGAWA INDUSTRIES CO., LTD.
- Toru MATSUZAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermally Conductive Composition
- Publication number 20200022259
- Publication date Jan 16, 2020
- KITAGAWA INDUSTRIES CO., LTD.
- Kensuke MITSUYA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...