Toshiyuki Sato

Person

Niigata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Varistor forming paste, cured product thereof, and varistor
- Patent number 11,935,673
- Issue date Mar 19, 2024
- Namics Corporation
- Pawel Czubarow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, paste for forming a varistor element, and varist...
- Patent number 10,141,090
- Issue date Nov 27, 2018
- Namics Corporation
- Yoshitaka Kamata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill composition for encapsulating a bond line
- Patent number 9,670,377
- Issue date Jun 6, 2017
- Namics Corporation
- Pawel Czubarow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of predicting viscosity behavior of thermosetting resin, sim...
- Patent number 9,417,228
- Issue date Aug 16, 2016
- Namics Corporation
- Toshiaki Enomoto
- G01 - MEASURING TESTING
Information Patent Grant
Liquid epoxy resin composition for semiconductor encapsulation
- Patent number 8,470,936
- Issue date Jun 25, 2013
- Namics Corporation
- Pawel Czubarow
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING S...
- Publication number 20240360310
- Publication date Oct 31, 2024
- NAMICS CORPORATION
- Hirotatsu IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND WIRING...
- Publication number 20230229079
- Publication date Jul 20, 2023
- Namics Corporation
- Pawel CZUBAROW
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW-VOLTAGE VARISTOR, CIRCUIT BOARD, SEMICONDUCTOR COMPONENT PACKAG...
- Publication number 20230139930
- Publication date May 4, 2023
- NAMICS CORPORATION
- Yoshitaka KAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARISTOR FORMING PASTE, CURED PRODUCT THEREOF, AND VARISTOR
- Publication number 20230013549
- Publication date Jan 19, 2023
- NAMICS CORPORATION
- Pawel Czubarow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS CARBON AND RESIN COMPOSITION
- Publication number 20220185667
- Publication date Jun 16, 2022
- NAMICS CORPORATION
- Pawel CZUBAROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOCURABLE RESIN COMPOSITION AND CURED PRODUCT OBTAINED BY CURING...
- Publication number 20220144993
- Publication date May 12, 2022
- NAMICS CORPORATION
- Pawel CZUBAROW
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PASTE FOR FORMING A VARISTOR ELEMENT, AND VARIST...
- Publication number 20180197663
- Publication date Jul 12, 2018
- NAMICS CORPORATION
- Yoshitaka KAMATA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
UNDERFILL COMPOSITION FOR ENCAPSULATING A BOND LINE
- Publication number 20150252217
- Publication date Sep 10, 2015
- NAMICS CORPORATION
- Pawel CZUBAROW
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PREDICTING VISCOSITY BEHAVIOR OF THERMOSETTING RESIN, SIM...
- Publication number 20140316102
- Publication date Oct 23, 2014
- Toshiaki Enomoto
- G01 - MEASURING TESTING
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND...
- Publication number 20130026660
- Publication date Jan 31, 2013
- NAMICS CORPORATION
- Pawel CZUBAROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND...
- Publication number 20130026661
- Publication date Jan 31, 2013
- NAMICS CORPORATION
- Pawel CZUBAROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FOR HIGH DENSITY INTERCONNECT FLIP CHIPS
- Publication number 20120172495
- Publication date Jul 5, 2012
- NAMICS CORPORATION
- Pawel Czubarow
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Toshiyuki Sato

Person

Patents Grantslast 30 patents

Varistor forming paste, cured product thereof, and varistor

Resin composition, paste for forming a varistor element, and varist...

Underfill composition for encapsulating a bond line

Method of predicting viscosity behavior of thermosetting resin, sim...

Liquid epoxy resin composition for semiconductor encapsulation

Patents Applicationslast 30 patents

RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING S...

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND WIRING...

LOW-VOLTAGE VARISTOR, CIRCUIT BOARD, SEMICONDUCTOR COMPONENT PACKAG...

VARISTOR FORMING PASTE, CURED PRODUCT THEREOF, AND VARISTOR

POROUS CARBON AND RESIN COMPOSITION

PHOTOCURABLE RESIN COMPOSITION AND CURED PRODUCT OBTAINED BY CURING...

RESIN COMPOSITION, PASTE FOR FORMING A VARISTOR ELEMENT, AND VARIST...

UNDERFILL COMPOSITION FOR ENCAPSULATING A BOND LINE

METHOD OF PREDICTING VISCOSITY BEHAVIOR OF THERMOSETTING RESIN, SIM...

LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND...

LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND...

UNDERFILL FOR HIGH DENSITY INTERCONNECT FLIP CHIPS