Toshiyuki SAWAMURA

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation sheet, heat dissipation member, and semiconductor...
- Patent number 11,834,603
- Issue date Dec 5, 2023
- Mitsubishi Chemical Corporation
- Toshiyuki Sawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Agglomerated boron nitride particles, production method for agglome...
- Patent number 10,414,653
- Issue date Sep 17, 2019
- MITSUBISHI CHEMICAL CORPORATION
- Katsura Ikemiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Agglomerated boron nitride particles, production method for agglome...
- Patent number 10,370,251
- Issue date Aug 6, 2019
- MITSUBISHI CHEMICAL CORPORATION
- Katsura Ikemiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Agglomerated boron nitride particles, production method for agglome...
- Patent number 10,106,413
- Issue date Oct 23, 2018
- MITSUBISHI CHEMICAL CORPORATION
- Katsura Ikemiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET,...
- Publication number 20250019489
- Publication date Jan 16, 2025
- MITSUBISHI CHEMICAL CORPORATION
- Toshiyuki TANAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT SHEET, COMPOSITE MOLDED BODY, AND...
- Publication number 20240010814
- Publication date Jan 11, 2024
- MITSUBISHI CHEMICAL CORPORATION
- Toshiyuki SAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN CURED PRODUCT, AND COMPOSITE MOLDED BODY
- Publication number 20210206943
- Publication date Jul 8, 2021
- MITSUBISHI CHEMICAL CORPORATION
- Akinori KIMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT DISSIPATION SHEET, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR...
- Publication number 20200407618
- Publication date Dec 31, 2020
- MITSUBISHI CHEMICAL CORPORATION
- Toshiyuki SAWAMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
AGGLOMERATED BORON NITRIDE PARTICLES, PRODUCTION METHOD FOR AGGLOME...
- Publication number 20180354793
- Publication date Dec 13, 2018
- MITSUBISHI CHEMICAL CORPORATION
- Katsura IKEMIYA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
AGGLOMERATED BORON NITRIDE PARTICLES, PRODUCTION METHOD FOR AGGLOME...
- Publication number 20160340191
- Publication date Nov 24, 2016
- MITSUBISHI CHEMICAL CORPORATION
- Katsura IKEMIYA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Toshiyuki SAWAMURA

Person

Patents Grantslast 30 patents

Heat dissipation sheet, heat dissipation member, and semiconductor...

Agglomerated boron nitride particles, production method for agglome...

Agglomerated boron nitride particles, production method for agglome...

Agglomerated boron nitride particles, production method for agglome...

Patents Applicationslast 30 patents

THERMOSETTING RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET,...

RESIN COMPOSITION, CURED PRODUCT SHEET, COMPOSITE MOLDED BODY, AND...

RESIN COMPOSITION, RESIN CURED PRODUCT, AND COMPOSITE MOLDED BODY

HEAT DISSIPATION SHEET, HEAT DISSIPATION MEMBER, AND SEMICONDUCTOR...

AGGLOMERATED BORON NITRIDE PARTICLES, PRODUCTION METHOD FOR AGGLOME...

AGGLOMERATED BORON NITRIDE PARTICLES, PRODUCTION METHOD FOR AGGLOME...