Toshiyuki Takewaki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,410,868
- Issue date Sep 10, 2019
- Renesas Electronics Corporation
- Takashi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with a multi-layered g...
- Patent number 9,984,884
- Issue date May 29, 2018
- Renesas Electronics Corporation
- Takashi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for manufacturing a semiconductor...
- Patent number 9,660,045
- Issue date May 23, 2017
- Renesas Electronics Corporation
- Takashi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with varying thickness of insulating film betw...
- Patent number 9,559,183
- Issue date Jan 31, 2017
- Renesas Electronics Corporation
- Takashi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,362,401
- Issue date Jun 7, 2016
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for manufacturing a semiconductor...
- Patent number 9,306,027
- Issue date Apr 5, 2016
- Renesas Electronics Corporation
- Takashi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high reliability and manufacturing method...
- Patent number 9,177,857
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Daisuke Oshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a strain relaxation film
- Patent number 9,070,661
- Issue date Jun 30, 2015
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having silicon-diffused metal wiring layer and...
- Patent number 8,642,467
- Issue date Feb 4, 2014
- Renesas Electronics Corporation
- Koichi Ohto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,486,836
- Issue date Jul 16, 2013
- Renesas Electronics Corporation
- Daisuke Oshida
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having dual damascene structure
- Patent number 8,487,442
- Issue date Jul 16, 2013
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,329,584
- Issue date Dec 11, 2012
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having silicon-diffused metal wiring layer and...
- Patent number 8,115,318
- Issue date Feb 14, 2012
- Renesas Electronics Corporation
- Koichi Ohto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical fuse and semiconductor device
- Patent number 8,053,863
- Issue date Nov 8, 2011
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,030,737
- Issue date Oct 4, 2011
- Renesas Electronics Corporation
- Daisuke Oshida
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,955,980
- Issue date Jun 7, 2011
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having dual damascene structure
- Patent number 7,936,072
- Issue date May 3, 2011
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having projection on lower electrode and metho...
- Patent number 7,897,475
- Issue date Mar 1, 2011
- Renesas Electronics Corporation
- Daisuke Oshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a refractory metal containing film and...
- Patent number 7,888,254
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 7,846,830
- Issue date Dec 7, 2010
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having silicon-diffused metal wiring layer and...
- Patent number 7,842,602
- Issue date Nov 30, 2010
- Renesas Electronics Corporation
- Koichi Ohto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including capacitor including upper electrode...
- Patent number 7,821,101
- Issue date Oct 26, 2010
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,745,937
- Issue date Jun 29, 2010
- NEC Electronics Corporation
- Tatsuya Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device featuring copper wiring la...
- Patent number 7,741,214
- Issue date Jun 22, 2010
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method having silicon-diffused metal wiring layer
- Patent number 7,737,555
- Issue date Jun 15, 2010
- NEC Electronics Corporation
- Koichi Ohto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow and wide copper interconnections composed of (111), (200) an...
- Patent number 7,728,432
- Issue date Jun 1, 2010
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse and seal ring
- Patent number 7,692,265
- Issue date Apr 6, 2010
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single damascene structure semiconductor device having silicon-diff...
- Patent number 7,687,917
- Issue date Mar 30, 2010
- NEC Electronics Corporation
- Koichi Ohto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having an interconne...
- Patent number 7,674,704
- Issue date Mar 9, 2010
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,633,138
- Issue date Dec 15, 2009
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180151377
- Publication date May 31, 2018
- RENESAS ELECTRONICS CORPORATION
- Takashi INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170103898
- Publication date Apr 13, 2017
- RENESAS ELECTRONICS CORPORATION
- Takashi INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20160204243
- Publication date Jul 14, 2016
- RENESAS ELECTRONICS CORPORATION
- Takashi INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150270394
- Publication date Sep 24, 2015
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20150145004
- Publication date May 28, 2015
- Renesas Electronics Corporation
- Takashi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150061038
- Publication date Mar 5, 2015
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140353720
- Publication date Dec 4, 2014
- RENESAS ELECTRONICS CORPORATION
- Takashi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A HIGH-RELIABILITY SEMICONDUCTOR DEVICE
- Publication number 20120231623
- Publication date Sep 13, 2012
- RENESAS ELECTRONICS CORPORATION
- Daisuke OSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY...
- Publication number 20120115324
- Publication date May 10, 2012
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SILICON-DIFFUSED METAL WIRING LAYER AND...
- Publication number 20120108060
- Publication date May 3, 2012
- NEC ELECTRONICS CORPORATION
- Koichi Ohto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110318900
- Publication date Dec 29, 2011
- RENESAS ELECTRONICS CORPORATION
- Daisuke OSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110230051
- Publication date Sep 22, 2011
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device having dual damascene structure
- Publication number 20110169172
- Publication date Jul 14, 2011
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SILICON-DIFFUSED METAL WIRING LAYER AND...
- Publication number 20100224995
- Publication date Sep 9, 2010
- NEC ELECTRONICS CORPORATION
- Koichi Ohto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical fuse and semiconductor device
- Publication number 20100032797
- Publication date Feb 11, 2010
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090305496
- Publication date Dec 10, 2009
- NEC ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH RELIABILITY AND MANUFACTURING METHOD...
- Publication number 20090184421
- Publication date Jul 23, 2009
- NEC ELECTRONICS CORPORATION
- Daisuke Oshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM AND...
- Publication number 20090176364
- Publication date Jul 9, 2009
- NEC ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN INTERCONNE...
- Publication number 20090149018
- Publication date Jun 11, 2009
- NEC ELECTRONICS CORPORATION
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having dual damascene structure
- Publication number 20090121360
- Publication date May 14, 2009
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090115022
- Publication date May 7, 2009
- NEC ELECTRONICS COROPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE FEATURING COPPER WIRING LA...
- Publication number 20090081870
- Publication date Mar 26, 2009
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including capacitor including upper electrode...
- Publication number 20080277762
- Publication date Nov 13, 2008
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having projection on lower electrode and metho...
- Publication number 20080237793
- Publication date Oct 2, 2008
- NEC Electronics Corporation
- Daisuke Oshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080217737
- Publication date Sep 11, 2008
- NEC Electronics Corporation
- Daisuke OSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20080160686
- Publication date Jul 3, 2008
- NEC Electronics Corporation
- Ikuo NAKAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANFACTURING SEMICONCUDTOR DEVICE
- Publication number 20080160750
- Publication date Jul 3, 2008
- NEC ELECTRONICS CORPORATION
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device having an interconne...
- Publication number 20080064202
- Publication date Mar 13, 2008
- NEC ELECTRONICS CORPORATION
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing same
- Publication number 20080044997
- Publication date Feb 21, 2008
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080017993
- Publication date Jan 24, 2008
- NEC Electronics Corporation
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS

Toshiyuki Takewaki

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing semiconductor device with a multi-layered g...

Semiconductor device and a method for manufacturing a semiconductor...

Semiconductor device with varying thickness of insulating film betw...

Semiconductor device

Semiconductor device and a method for manufacturing a semiconductor...

Semiconductor device with high reliability and manufacturing method...

Semiconductor device including a strain relaxation film

Semiconductor device having silicon-diffused metal wiring layer and...

Semiconductor device and method of manufacturing the same

Semiconductor device having dual damascene structure

Method of manufacturing semiconductor device

Semiconductor device having silicon-diffused metal wiring layer and...

Electrical fuse and semiconductor device

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device

Semiconductor device having dual damascene structure

Semiconductor device having projection on lower electrode and metho...

Semiconductor device having a refractory metal containing film and...

Semiconductor device and method for manufacturing same

Semiconductor device having silicon-diffused metal wiring layer and...

Semiconductor device including capacitor including upper electrode...

Semiconductor device and method of manufacturing the same

Method of forming a semiconductor device featuring copper wiring la...

Semiconductor method having silicon-diffused metal wiring layer

Narrow and wide copper interconnections composed of (111), (200) an...

Fuse and seal ring

Single damascene structure semiconductor device having silicon-diff...

Method of manufacturing a semiconductor device having an interconne...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A HIGH-RELIABILITY SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY...

SEMICONDUCTOR DEVICE HAVING SILICON-DIFFUSED METAL WIRING LAYER AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device having dual damascene structure

SEMICONDUCTOR DEVICE HAVING SILICON-DIFFUSED METAL WIRING LAYER AND...

Electrical fuse and semiconductor device

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH HIGH RELIABILITY AND MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM AND...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN INTERCONNE...

Semiconductor device having dual damascene structure

SEMICONDUCTOR DEVICE

METHOD OF FORMING A SEMICONDUCTOR DEVICE FEATURING COPPER WIRING LA...

Semiconductor device including capacitor including upper electrode...

Semiconductor device having projection on lower electrode and metho...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHOD OF MANFACTURING SEMICONCUDTOR DEVICE

Method of manufacturing a semiconductor device having an interconne...

Semiconductor device and method for manufacturing same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME