Toshiyuki Tateishi

Person

Ota-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Device chip package manufacturing method
- Patent number 10,431,496
- Issue date Oct 1, 2019
- Disco Corporation
- Toshiyuki Tateishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device chip manufacturing method
- Patent number 9,935,008
- Issue date Apr 3, 2018
- Disco Corporation
- Toshiyuki Tateishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and manufacturing method thereof
- Patent number 8,318,518
- Issue date Nov 27, 2012
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing method
- Patent number 7,549,560
- Issue date Jun 23, 2009
- Disco Corporation
- Yusuke Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing method
- Patent number 6,498,075
- Issue date Dec 24, 2002
- Disco Corporation
- Kouji Fujimoto
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process for producing a large number of semiconductor chips from a...
- Patent number 6,448,151
- Issue date Sep 10, 2002
- Disco Corporation
- Toshiyuki Tateishi
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
GRINDING WHEEL
- Publication number 20190134782
- Publication date May 9, 2019
- Disco Corporation
- Toshiyuki TATEISHI
- B24 - GRINDING POLISHING
Information Patent Application
DEVICE CHIP PACKAGE MANUFACTURING METHOD
- Publication number 20180144981
- Publication date May 24, 2018
- Disco Corporation
- Toshiyuki Tateishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CHIP MANUFACTURING METHOD
- Publication number 20180012804
- Publication date Jan 11, 2018
- Disco Corporation
- Toshiyuki Tateishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110133235
- Publication date Jun 9, 2011
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100261309
- Publication date Oct 14, 2010
- Disco Corporation
- Toshiyuki Tateishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer dividing method
- Publication number 20050259459
- Publication date Nov 24, 2005
- DISCO CORPORATION
- Yusuke Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing a large number of semiconductor chips from a...
- Publication number 20020016047
- Publication date Feb 7, 2002
- Toshiyuki Tateishi
- B28 - WORKING CEMENT, CLAY, OR STONE

Toshiyuki Tateishi

Person

Patents Grantslast 30 patents

Device chip package manufacturing method

Semiconductor device chip manufacturing method

Light emitting device and manufacturing method thereof

Wafer dividing method

Dicing method

Process for producing a large number of semiconductor chips from a...

Patents Applicationslast 30 patents

GRINDING WHEEL

DEVICE CHIP PACKAGE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE CHIP MANUFACTURING METHOD

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Wafer dividing method

Process for producing a large number of semiconductor chips from a...