Toshiyuki Yoshikawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Processing method of workpiece
- Patent number 12,191,138
- Issue date Jan 7, 2025
- Disco Corporation
- Toshio Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus
- Patent number 11,764,085
- Issue date Sep 19, 2023
- Disco Corporation
- Yukiyasu Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing method and device chip manufacturing method
- Patent number 11,251,083
- Issue date Feb 15, 2022
- Disco Corporation
- Kenta Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film applying apparatus and protective film applying method
- Patent number 10,086,474
- Issue date Oct 2, 2018
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 9,748,119
- Issue date Aug 29, 2017
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dividing plate-shaped workpieces
- Patent number 9,685,378
- Issue date Jun 20, 2017
- Disco Corporation
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 9,620,355
- Issue date Apr 11, 2017
- Disco Corporation
- Senichi Ryo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film agent for laser dicing and wafer processing method...
- Patent number 9,090,783
- Issue date Jul 28, 2015
- TOKYO OHKA KOGYO CO., LTD.
- Hiroshi Takanashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of detecting condensing spot position in laser beam processi...
- Patent number 8,957,347
- Issue date Feb 17, 2015
- Disco Corporation
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dividing method
- Patent number 7,737,002
- Issue date Jun 15, 2010
- Disco Corporation
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor chip
- Patent number 7,648,850
- Issue date Jan 19, 2010
- Disco Corporation
- Toshiyuki Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer treatment method
- Patent number 7,468,309
- Issue date Dec 23, 2008
- Disco Corporation
- Koichi Shigematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer laser processing method
- Patent number 7,446,022
- Issue date Nov 4, 2008
- Disco Corporation
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backlight device for liquid crystal display
- Patent number 7,440,049
- Issue date Oct 21, 2008
- Kuraray Co., Ltd.
- Toshiyuki Yoshikawa
- G02 - OPTICS
Information Patent Grant
Wafer processing method
- Patent number 7,399,682
- Issue date Jul 15, 2008
- Disco Corporation
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser beam processing method for a semiconductor wafer
- Patent number 7,265,033
- Issue date Sep 4, 2007
- Disco Corporation
- Koichi Shigematsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 7,179,723
- Issue date Feb 20, 2007
- Disco Corporation
- Satoshi Genda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dividing a workpiece in the form of a plate having a laye...
- Patent number 7,087,857
- Issue date Aug 8, 2006
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser beam processing machine
- Patent number 6,998,571
- Issue date Feb 14, 2006
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightguide
- Patent number 6,259,854
- Issue date Jul 10, 2001
- Kuraray Co., Ltd.
- Osamu Shinji
- G02 - OPTICS
Information Patent Grant
Lightguide having trapezoidally-shaped main body with a level surfa...
- Patent number 6,215,936
- Issue date Apr 10, 2001
- Kuraray Co., Ltd.
- Toshiyuki Yoshikawa
- G02 - OPTICS
Information Patent Grant
Panel light source device and display comprising it
- Patent number 6,086,212
- Issue date Jul 11, 2000
- Kuraray Co., Ltd.
- Ikuo Onishi
- G02 - OPTICS
Information Patent Grant
Method of manufacturing light-transmitting plates
- Patent number 5,776,636
- Issue date Jul 7, 1998
- Kuraray Co., Ltd.
- Toshitaka Kunisawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE FILM SUBSTANCE FOR LASER PROCESSING AND METHOD OF PROCES...
- Publication number 20220392805
- Publication date Dec 8, 2022
- Disco Corporation
- Senichi RYO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESSING APPARATUS
- Publication number 20220270910
- Publication date Aug 25, 2022
- Disco Corporation
- Yoshinori KAKINUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20220108882
- Publication date Apr 7, 2022
- Disco Corporation
- Toshio TSUCHIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING APPARATUS
- Publication number 20220020614
- Publication date Jan 20, 2022
- Disco Corporation
- Yukiyasu MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING PERFORMANCE CONFIRMATION METHOD FOR LASER PROCESSING APP...
- Publication number 20210039197
- Publication date Feb 11, 2021
- Disco Corporation
- Toshiyuki YOSHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD
- Publication number 20200185277
- Publication date Jun 11, 2020
- Disco Corporation
- Kenta NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM APPLYING APPARATUS AND PROTECTIVE FILM APPLYING METHOD
- Publication number 20170368636
- Publication date Dec 28, 2017
- Disco Corporation
- Senichi Ryo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD OF DIVIDING PLATE-SHAPED WORKPIECES
- Publication number 20170076985
- Publication date Mar 16, 2017
- Disco Corporation
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170032985
- Publication date Feb 2, 2017
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170025269
- Publication date Jan 26, 2017
- Disco Corporation
- Senichi Ryo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETECTING CONDENSING SPOT POSITION IN LASER BEAM PROCESSI...
- Publication number 20130082038
- Publication date Apr 4, 2013
- Disco Corporation
- Toshiyuki YOSHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM AGENT FOR LASER DICING AND WAFER PROCESSING METHOD...
- Publication number 20100304551
- Publication date Dec 2, 2010
- Tokyo Ohka Kogyo Co., Ltd.
- Hiroshi Takanashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer dividing method
- Publication number 20070293021
- Publication date Dec 20, 2007
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing semiconductor chip
- Publication number 20070190749
- Publication date Aug 16, 2007
- DISCO CORPORATION
- Toshiyuki Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backlight device for liquid crystal display
- Publication number 20070103929
- Publication date May 10, 2007
- Toshiyuki Yoshikawa
- G02 - OPTICS
Information Patent Application
Semiconductor wafer treatment method
- Publication number 20060223285
- Publication date Oct 5, 2006
- DISCO CORPORATION
- Koichi Shigematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer laser processing method
- Publication number 20060216911
- Publication date Sep 28, 2006
- DISCO CORPORATION
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser processing method and laser beam processing machine
- Publication number 20060197260
- Publication date Sep 7, 2006
- DISCO CORPORATION
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protective film agent for laser dicing and wafer processing method...
- Publication number 20060105544
- Publication date May 18, 2006
- Tokyo Ohka Kogyo Co., Ltd.
- Hiroshi Takanashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer processing method
- Publication number 20050277270
- Publication date Dec 15, 2005
- DISCO CORPORATION
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer processing method
- Publication number 20050106782
- Publication date May 19, 2005
- Satoshi Genda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of dividing a plate-like workpiece
- Publication number 20050035099
- Publication date Feb 17, 2005
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser beam processing method and laser beam processing machine
- Publication number 20050009307
- Publication date Jan 13, 2005
- Koichi Shigematsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser beam processing machine
- Publication number 20040211762
- Publication date Oct 28, 2004
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining method and laser machining apparatus
- Publication number 20040140300
- Publication date Jul 22, 2004
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Toshiyuki Yoshikawa

Person

Patents Grantslast 30 patents

Processing method of workpiece

Processing apparatus

Workpiece processing method and device chip manufacturing method

Protective film applying apparatus and protective film applying method

Wafer processing method

Method of dividing plate-shaped workpieces

Wafer processing method

Protective film agent for laser dicing and wafer processing method...

Method of detecting condensing spot position in laser beam processi...

Wafer dividing method

Method for producing semiconductor chip

Semiconductor wafer treatment method

Wafer laser processing method

Backlight device for liquid crystal display

Wafer processing method

Laser beam processing method for a semiconductor wafer

Wafer processing method

Method of dividing a workpiece in the form of a plate having a laye...

Laser beam processing machine

Lightguide

Lightguide having trapezoidally-shaped main body with a level surfa...

Panel light source device and display comprising it

Method of manufacturing light-transmitting plates

Patents Applicationslast 30 patents

PROTECTIVE FILM SUBSTANCE FOR LASER PROCESSING AND METHOD OF PROCES...

PROCESSING APPARATUS

PROCESSING METHOD OF WORKPIECE

PROCESSING APPARATUS

PROCESSING PERFORMANCE CONFIRMATION METHOD FOR LASER PROCESSING APP...

WORKPIECE PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD

PROTECTIVE FILM APPLYING APPARATUS AND PROTECTIVE FILM APPLYING METHOD

METHOD OF DIVIDING PLATE-SHAPED WORKPIECES

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

METHOD OF DETECTING CONDENSING SPOT POSITION IN LASER BEAM PROCESSI...

PROTECTIVE FILM AGENT FOR LASER DICING AND WAFER PROCESSING METHOD...

Wafer dividing method

Method for producing semiconductor chip

Backlight device for liquid crystal display

Semiconductor wafer treatment method

Wafer laser processing method

Laser processing method and laser beam processing machine

Protective film agent for laser dicing and wafer processing method...

Wafer processing method

Wafer processing method

Method of dividing a plate-like workpiece

Laser beam processing method and laser beam processing machine

Laser beam processing machine

Laser machining method and laser machining apparatus