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Patents Grantslast 30 patents

Information Patent Grant
Surface mounting structure
- Patent number 5,926,375
- Issue date Jul 20, 1999
- Hitachi, Ltd.
- Hideki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip module with heat sink and attachment means
- Patent number 5,844,311
- Issue date Dec 1, 1998
- Hitachi, Ltd.
- Hideki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device and method of producing the same
- Patent number 5,276,289
- Issue date Jan 4, 1994
- Hitachi, Ltd.
- Ryohei Satoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip module structure
- Patent number 4,930,002
- Issue date May 29, 1990
- Hitachi, Ltd.
- Takaji Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire stacked bonding method
- Patent number 4,875,618
- Issue date Oct 24, 1989
- Hitachi, Ltd.
- Hiroshi Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR