Tou-Sung Wu

Follow

Person

Taipei, TW

People

Patents Applicationslast 30 patents

Information Patent Application
Package structure for a multi-chip integrated circuit
- Publication number 20040183179
- Publication date Sep 23, 2004
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Open-type multichips stack packaging
- Publication number 20030160316
- Publication date Aug 28, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS