Touichi Sakata

Person

Katsuta, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,560,307
- Issue date Jul 14, 2009
- Hitachi Chemical Company, Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,061,081
- Issue date Jun 13, 2006
- Hitachi Chemical Co., Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoresistance adhesive and semiconductor device using the same
- Patent number 6,372,859
- Issue date Apr 16, 2002
- Hitachi Chemical Company, Ltd.
- Touichi Sakata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polyetheramide-imide polymer composition
- Patent number 4,791,157
- Issue date Dec 13, 1988
- Hitachi Chemical Co.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamide-imide resin composition
- Patent number 4,530,975
- Issue date Jul 23, 1985
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Mukoyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamide-imide resin and its production
- Patent number 4,294,952
- Issue date Oct 13, 1981
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Mukoyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20060180908
- Publication date Aug 17, 2006
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20030082925
- Publication date May 1, 2003
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Touichi Sakata

Person

Patents Grantslast 30 patents

Resin composition, heat-resistant resin paste and semiconductor dev...

Resin composition, heat-resistant resin paste and semiconductor dev...

Thermoresistance adhesive and semiconductor device using the same

Polyetheramide-imide polymer composition

Polyamide-imide resin composition

Polyamide-imide resin and its production

Patents Applicationslast 30 patents

Resin composition, heat-resistant resin paste and semiconductor dev...

Resin composition, heat-resistant resin paste and semiconductor dev...